Finite Element Analysis of Stress Concentration at Rounded Crack Tip with Different Physical Parameters

Article Preview

Abstract:

This paper investigates the effect of physical parameters of a rounded crack on the stress concentration near crack tip. The depth and radius at the crack tip are the two physical parameters concerned in this study. The finite element method was used to evaluate the stress value at the crack tip for a silicon chip with a tiny crack under tensile stress. Element type, shape and physical parameters of crack were varied to study their effect on the stress concentration near the crack. The simulation results were compared with the theoretical value, and the better physical parameters as well as the element type, element shape were discussed.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

230-234

Citation:

Online since:

December 2013

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] X. Li, S. Kasai, S. Nakao, T. Ando, M. Shikida, K. Sato: Fatigue Fract Engng Mater Struct Vol. 30 (2007) p.1172.

Google Scholar

[2] M. George, C. Coupeau, J. Colin, J. Grilhe: Thin Solid Films Vol. 429 (2003) p.267.

Google Scholar

[3] S. Zhang, D. Sun, Y. Fu, H. Du: Surface & Coatings Technology Vol. 198 (2005) p.2.

Google Scholar

[4] C.T. Huang: Stress Relaxation of V-shaped Notch on Single Crystal Silicon Using Nanoholes (Master's Thesis, National Tsing Hua University 2009).

Google Scholar

[5] S. Kumar, X. Li, Aman Haque, and H. Gao: Nano Letter Vol. 11 (2011) p.2510.

Google Scholar

[6] C.R. Chiang: Journal of Strain Analysis 33 (1998) p.395.

Google Scholar

[7] W.D. Pilkey: Peterson's stress concentration factors (Wiley-Interscience, New York 1997).

Google Scholar

[8] C.J. Wilson, A. Ormeggi, M. Narbutoskih: Journal of Applied Physics Vol. 79 (1996) p.2386.

Google Scholar