A Novel Heat Sink for High Power Light Emitting Diode-Phase Change Heat Sink
A novel heat sink was fabricated for packaging cooling of high power LED. Enhanced boiling structures in the evaporation surface were processed by ploughing-extrusion (P-E) and stamping methods, respectively. The cycle power of refrigerant was supplied by wick of sintered copper powder on internal surface of phase change heat sink. The experimental results showed that phase change heat sink was provided with a good heat transfer capability and the temperature of phase change heat sink reached 86.8°C under input power of 10W LED at ambient temperature of 20°C.
Shaobo Zhong, Yimin Cheng and Xilong Qu
J.H. Xiang et al., "A Novel Heat Sink for High Power Light Emitting Diode-Phase Change Heat Sink", Applied Mechanics and Materials, Vols. 50-51, pp. 278-282, 2011