Study on the Modification of Polishing Putty by Inorganic Filler

Abstract:

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In order to decrease the cost of polishing putty, the interrelations between talcum powder as the filler and KH550, KH560, or silane compound coupler were investigated by atomic force microscopy (AFM) and Fourier transform infrared spectrum (FTIR). It was proved that the effect of Modification of KH560 coupler is the best.

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Periodical:

Edited by:

Shaobo Zhong, Yimin Cheng and Xilong Qu

Pages:

780-784

DOI:

10.4028/www.scientific.net/AMM.50-51.780

Citation:

C. B. Bi "Study on the Modification of Polishing Putty by Inorganic Filler", Applied Mechanics and Materials, Vols. 50-51, pp. 780-784, 2011

Online since:

February 2011

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$35.00

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