Study on the Modification of Polishing Putty by Inorganic Filler

Chun Bo Bi

doi:10.4028/www.scientific.net/AMM.50-51.780

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 50-51Study on the Modification of Polishing Putty by...

Study on the Modification of Polishing Putty by Inorganic Filler

Abstract:

In order to decrease the cost of polishing putty, the interrelations between talcum powder as the filler and KH550, KH560, or silane compound coupler were investigated by atomic force microscopy (AFM) and Fourier transform infrared spectrum (FTIR). It was proved that the effect of Modification of KH560 coupler is the best.

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Periodical:

Applied Mechanics and Materials (Volumes 50-51)

Pages:

780-784

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.50-51.780

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Online since:

February 2011

Authors:

Chun Bo Bi

Keywords:

Couple, Inorganic Filler, Modification, Putty

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