Study on the Modification of Polishing Putty by Inorganic Filler
In order to decrease the cost of polishing putty, the interrelations between talcum powder as the filler and KH550, KH560, or silane compound coupler were investigated by atomic force microscopy (AFM) and Fourier transform infrared spectrum (FTIR). It was proved that the effect of Modification of KH560 coupler is the best.
Shaobo Zhong, Yimin Cheng and Xilong Qu
C. B. Bi "Study on the Modification of Polishing Putty by Inorganic Filler", Applied Mechanics and Materials, Vols. 50-51, pp. 780-784, 2011