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Application and Analysis of Parametric Substructure's New Modeling Method in PCB Components
Abstract:
With the progress and development of modern society, various electronic equipments not only have been enriching our lives, but also have become an indispensable tool for people. At present, the electronic equipment is moving towards the direction of becoming more integrated, smaller and more accurate, which requires good dynamic performance and stability. This paper builds the finite element model and makes optimization and analysis for its structure through analyzing the dynamic performance of electronic components. On the basis of the analysis, this paper puts forward a new modeling method having the parametric substructure. In addition, the genetic algorithm is used to dynamically analyze and optimally combine the components on printed circuit boards. Finally through a concrete instance, this paper calculates its rationality and validity.
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Pages:
3194-3198
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Online since:
February 2014
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© 2014 Trans Tech Publications Ltd. All Rights Reserved
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