Numerical Simulation Analysis of Electronic Equipment Thermal Reliability in Steady-State Temperature Field

Abstract:

In recent years, with the rapid development of electronic information technology, electronic devices are used in all areas of our lives. The power consumption is transmitted to the surrounding through the form of heat when electronic components at work. Each of the components is a source of heat when it is working. If it works in a hot environment long times, the stability will be affected and its life will also decreases. Therefore, in the initial design phase of electronic equipment, thermal stability and thermal reliability must be analyzed to reduce these uncertainties. This article solve the optimal layout problem of components in PCB board by establish micro unit heat balance method. It also concludes that the micro unit heat balance method is reasonable through ANSYS finite element analysis.

• Periodical: Applied Mechanics and Materials (Volumes 513-517)
• Pages: 3184-3187
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.513-517.3184
• Online since: February 2014
• Authors: Wei Ming Li*
• Keywords: ANSYS, Electronic Devices, Heat Balance, Numerical Simulation

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