Three-Dimensional Electromechanical Impedance Model for Damaged Beams with Imperfectly Bonded Piezoelectric Patches

Abstract:

Dynamic analysis is conducted for a cracked beam with imperfectly bonded piezoelectric patches using the finite element method in the paper. The property of adhesive between the PZT patches and the host beam is taken into account based on the peel stress model as well as the shear lag model and thus the three-dimensional (3D) model of piezoelectric patch-adhesive-host beam coupled system is developed. Based on the established three-dimensional EMI model, the effect of some physical parameters such as vibration mode of main structure, the mass of adhesive layer and crack depth etc. on electromechanical impedance signatures is investigated. Finally, the root-mean-square deviation (RMSD), a kind of non-parametric damage index, is also employed to identify the damage severity of the cracked beam.

• Periodical: Applied Mechanics and Materials (Volumes 52-54)
• Pages: 1285-1290
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.52-54.1285
• Online since: March 2011
• Authors: Wan Chun Li, Wei Yan, Wei Wang
• Keywords: Damage Detection, Electromechanical Impedance (EMI), Finite Element Model (FEM), PZT

References

[1] V.G.M. Annamdas and C.K. Soh: Three-Dimensional Electromechanical Impedance Model for Multiple Piezoceramic Transducers-Structure Interaction, J. Aeros. Eng. Vol. 21 (2008), p.1.

DOI: 10.1061/(asce)0893-1321(2008)21:1(35)

[2] V.G.M. Annamdas and C.K. Soh: An Electromechanical Impedance Model of a Piezoceramic Transducer-Structure in the Presence of Thick Adhesive Bonding, Smart Mater. Struct. Vol. 16 (2007), p.673–686.

DOI: 10.1088/0964-1726/16/3/014

[3] W. Yan, J.B. Cai and W. Q Chen.: Monitoring Interfacial Defects in a Composite Beam using Impedance Signatures, J. Sound Vib. Vol. 326 (2009), pp.340-352.

DOI: 10.1016/j.jsv.2009.04.030

[4] L.Y. Tong and Q.T. Luo: Exact Dynamic Solutions to Piezoelectric Smart Beams Including Peel Stresses I: Theory and Application, Int. J. Solids Structures. Vol. 40 (2003), p.4789–4812.

DOI: 10.1016/s0020-7683(03)00264-6

[5] Y. Chen: Research on Piezoelectric Impedance Tchnology for Structural Health Monitoring, Master's thesis. Zhejiang University, Hangzhou, China, (2010).

[6] T. Makkonen, A. Holappa, J. Ella and M.M. Salomaa: Finite Element Simulations of Thin-film Composite BAW Resonators IEEE Transducers, Ultrason. Ferroelectr. Freq. Control. Vol. 48 (2001), p.41–58.

DOI: 10.1109/58.949733

[7] C. Cai, H. Zheng, M.S. Khan and K.C. Hung: Modeling of Material Damping Properties in ANSYS, CADFEM Users' Meeting & ANSYS Conference. Friedrichshafen, Germany, (2002).

[8] X.P. Mo: Simulation and Analysis of Acoustics Transducers using the ANSYS Software, Tech. Acoust. Vol. 26 (2007), pp.1279-1290.

[9] W. Yan, W.Q. Chen, C.W. Lim and B. Cai: Application of EMI Technique for Crack Detection in Continuous Beams Adhesively Bonded with Multiple Piezoelectric Patches, Mech. Adv. Mater. Struc. Vol. 15 (2008), pp.1-11.

DOI: 10.1080/15376490701410513