Experimental Study on Low Temperature Sn-Bi Solder Paste

Yan Jiang; Li Da Sun; Zi Jing Li; Zhao Long Huang

doi:10.4028/www.scientific.net/AMM.543-547.3806

Paper Titles

Studies on Kinetics of Carbon Dioxide Conversion under Atmospheric Pressure
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The Adsorption Characteristics of Zinc(II) by Coconut Activated Carbon
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Experimental Study on Low Temperature Sn-Bi Solder Paste
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Determination of Melting Point of Polyethylene Based on Inverse Opal
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 543-547Experimental Study on Low Temperature Sn-Bi Solder...

Experimental Study on Low Temperature Sn-Bi Solder Paste

Abstract:

For lack of existing low temperature solder paste , developed a low-temperature Sn-Bi solder paste, focused on finding the optimal formula , at the same time on the flux of the solder paste, is printing performance and wettability can be tested through performance test to find the optimal flux formula.

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Periodical:

Applied Mechanics and Materials (Volumes 543-547)

Pages:

3806-3809

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.543-547.3806

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Online since:

March 2014

Authors:

Yan Jiang*, Li Da Sun, Zi Jing Li, Zhao Long Huang

Keywords:

Flux, Low Temperatures, Sn-Bi Solder Paste

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* - Corresponding Author

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