The Analysis of Bonding Mechanism of CBN Grains for Electroplated Superabrasive Tools

Geng Zhi; Wei Yao Bi; Jia Jun Tang; Yi Ming Rong

doi:10.4028/www.scientific.net/AMM.543-547.448

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 543-547The Analysis of Bonding Mechanism of CBN Grains...

The Analysis of Bonding Mechanism of CBN Grains for Electroplated Superabrasive Tools

Abstract:

This paper analyzed the failure modes of single layer electroplated uperabrasive products. The bonding force is the primary factor that dominates the grinding quality and tool life. So the understanding of bonding mechanism is of great importance for improving efficiency and quality in the applications of these abrasive products. In this paper, the experimental setup similar to an inclined micro-threading process is designed to observe and measure the failure mode and maximum bonding force respectively. The relationship between maximum bonding force and bonding layer thickness is established through the experiment. In addition, failure modes are analyzed by comparing the morphology before and after the high speed bonding force test for electroplated layer.

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Periodical:

Applied Mechanics and Materials (Volumes 543-547)

Pages:

448-451

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.543-547.448

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Online since:

March 2014

Authors:

Geng Zhi*, Wei Yao Bi, Jia Jun Tang, Yi Ming Rong

Keywords:

Bonding Force, Bonding Mechanism, Electroplated Tools, Superabrasives

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