Investigation of Shear and Thermal Characteristics of Polishing Interface in Soft Pad Polishing Process

Abstract:

In the current study, a high precision polishing process test bench with in-situ measurement technology was developed. The test bench also adopted to investigate the effects of operating parameters on polishing interfacial phenomena during the polishing process with IC1000 pad. The experimental results coincide with the experimental and theoretical data published previously results. The developed test rig and the current experimental outcomes contribute to the understanding of soft pad polishing mechanism.

• Periodical: Applied Mechanics and Materials (Volumes 55-57)
• Pages: 508-511
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.55-57.508
• Online since: May 2011
• Authors: Hung Jung Tsai, Pay Yau Huang, Ming Yi Tsai, Hung Cheng Tsai, Cin Jhe Lin
• Keywords: Bench Test, Interfacial Phenomena, Polishing Pad, Polishing Process

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