Investigation of Shear and Thermal Characteristics of Polishing Interface in Soft Pad Polishing Process

Abstract:

Article Preview

In the current study, a high precision polishing process test bench with in-situ measurement technology was developed. The test bench also adopted to investigate the effects of operating parameters on polishing interfacial phenomena during the polishing process with IC1000 pad. The experimental results coincide with the experimental and theoretical data published previously results. The developed test rig and the current experimental outcomes contribute to the understanding of soft pad polishing mechanism.

Info:

Periodical:

Edited by:

Qi Luo

Pages:

508-511

DOI:

10.4028/www.scientific.net/AMM.55-57.508

Citation:

H. J. Tsai et al., "Investigation of Shear and Thermal Characteristics of Polishing Interface in Soft Pad Polishing Process", Applied Mechanics and Materials, Vols. 55-57, pp. 508-511, 2011

Online since:

May 2011

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Price:

$35.00

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