COP Improvement of Thermoelectric Cooler through the Optimization of Heat Dissipation System

Mohd Bin Sulaiman Hafis; Mohd Jamir Mohd Ridzuan; Ahamad Zaidi Ahmad Firdaus; S.M. Shahril; R.N. Farahana; C.K. Chong

doi:10.4028/www.scientific.net/AMM.554.241

Paper Titles

The Influence of Seawater Velocity to the Corrosion Rate and Paint Degradation at Mild Steel Plate Immersed in Sea Water
p.218

Computational Investigation of Film Cooling from Cylindrical and Row Trenched Cooling Holes near the Combustor End Wall
p.225

Application of the Lattice Boltzmann Method for Fluid Flow around Complex Geometry
p.230

Film-Cooling Techniques at the End of Combustor and Inlet of Turbine in a Gas Turbine Engine: A Review
p.236

COP Improvement of Thermoelectric Cooler through the Optimization of Heat Dissipation System
p.241

ANFIS Direct Inverse Control of Substrate in an Activated Sludge Wastewater Treatment System
p.246

The Effect of Water Hammer on Pressure Oscillation of Hydrogen Natural Gas Transient Flow
p.251

Energy Savings on Automotive Air Conditioner Using Liquid-Suction Heat Exchanger Subcooler
p.256

Numerical Analysis of Modified Ejector Cycle on Ejector as an Expansion Device on Residential Air Conditioner
p.261

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 554COP Improvement of Thermoelectric Cooler through...

COP Improvement of Thermoelectric Cooler through the Optimization of Heat Dissipation System

Abstract:

This paper presents theoretical and experimental works on the effect of heat transfer for a thermoelectric (TE) cooling system. The study focuses on thermal performance of the system through the optimisation of heat dissipation system for two prototypes that have aluminium and copper heat sink design, respectively. The study revealed that heat sink base area and fin height influenced thermal performance.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volume 554)

Pages:

241-245

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.554.241

Citation:

Cite this paper

Online since:

June 2014

Authors:

Mohd Bin Sulaiman Hafis*, Mohd Jamir Mohd Ridzuan, Ahamad Zaidi Ahmad Firdaus, S.M. Shahril, R.N. Farahana, C.K. Chong

Keywords:

Cooling System, Heat Dissipation, Heat Sink, Heat Transfer

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] John T. McMullan, Refrigeration and the environment - Issues and strategies for the future, Int. J. Refrig. 25 (2002) 89-99.

Google Scholar

[2] Zhi-Gang Chen, Guang Han, Lei Yang, Lina Cheng, Jin Zou, Nanostructure thermoelectric materials: current research and future challenge, Prog. In Natural Science: Mat. Int. 22 (2012) 535-549.

DOI: 10.1016/j.pnsc.2012.11.011

Google Scholar

[3] Huang, B. J., Chin, C. J., Duang, C. L., A design method of thermoelectric cooler, Int. J. Refrig. 23 (2000) 208-218.

DOI: 10.1016/s0140-7007(99)00046-8

Google Scholar

[4] R Arularasan, R Velraj, CFD analysis in a heat sink for cooling of electronic devices, Int. J. Comp. Intern. Manage. 16 (2008) 1-11.

Google Scholar

[5] Reiyu Chein, Yehong Chen, Performance of thermoelectric cooler integrated with microchannel heat sinks, Int. J. Refrig. 28 (2005) 828-839.

DOI: 10.1016/j.ijrefrig.2005.02.001

Google Scholar

[6] American Society of Heating, Refrigerating and Air-Conditioning Engineers, in: ASHRAE Handbook of Fundamentals 1972, ASHRAE, New York, (1972).

Google Scholar

[7] Yunus A. Cengel, Michael A. Boles, in: Thermodynamics: An Engineering Approach, seventh ed. McGraw Hill, New York, (2010).

Google Scholar