The Effects of Nickel Underlayer and Solder Dipping as Tin Whisker Mitigations in Tin Surface Finishes

Hooi Peng Lim; Ali Ourdjini; Tuty Asma Abu Bakar

doi:10.4028/www.scientific.net/AMM.554.47

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 554The Effects of Nickel Underlayer and Solder...

The Effects of Nickel Underlayer and Solder Dipping as Tin Whisker Mitigations in Tin Surface Finishes

Abstract:

Driven by environmental concerns and the enforcement of Restriction of Hazardous Substances Directive (RoHS) to ban the use of lead in electronics, the global electronics industry has migrated toward lead-free electronics. However, the adoption of lead-free tin (Sn) surface finish is known to form whiskers. These whiskers grow spontaneously from the Sn finish layer as a stress-relief over time causing device failures. In the present research, whisker growth is investigated via immersion Sn finishes on Cu substrate. The effects of Sn layer thickness, addition of Ni under-layer and solder dipping on whisker growth are investigated by storing the samples under ambient temperature for up to 24 weeks. The effects of external stresses were also studied using bending test. The results showed that whisker length on immersion Sn increases with time for all the samples either with or without Ni under-layer. Thicker Sn coating showed more whisker growth compared with thinner Sn coating. The longest whisker length of 23μm was observed for Sn coating with 2μm thickness. The addition of Ni as under-layer was found to be more effective in mitigating the whisker growth by extending the incubation time for whisker formation. Compared to immersion Sn, solder dipping in pure Sn showed no whisker growth. However, alloying Sn with 0.4%wtCu resulted in whisker growth indicating the role of Cu in promoting whiskers formation.

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Periodical:

Applied Mechanics and Materials (Volume 554)

Pages:

47-51

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.554.47

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Online since:

June 2014

Authors:

Hooi Peng Lim, Ali Ourdjini, Tuty Asma Abu Bakar

Keywords:

Immersion Tin, Nickel Under-Layer, Solder Dipping, TiN Whisker

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