Research on Spring-Back Simulation and Die Surface Optimization of Automotive Panel Stamping Process

Hao Song; Da Sen Bi; Chao Li; Xiao Guan; Guang Yang

doi:10.4028/www.scientific.net/AMM.577.94

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 577Research on Spring-Back Simulation and Die Surface...

Research on Spring-Back Simulation and Die Surface Optimization of Automotive Panel Stamping Process

Abstract:

The spring-back phenomenon in automotive panel forming is one of the main quality problems, which may affect the tolerance and final shape of panel products. The stamping and spring-back process simulation for the automotive panel were realized by using the Auto form software, emphasizing on the possibly spring-back quantity forecasted and the die surface was optimized to control spring-back. The reasonability of optimization scheme was proved by comparing the simulation result with the actual part.

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Periodical:

Applied Mechanics and Materials (Volume 577)

Pages:

94-97

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.577.94

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Online since:

July 2014

Authors:

Hao Song*, Da Sen Bi, Chao Li, Xiao Guan, Guang Yang

Keywords:

Automotive Panel, Die Surface Optimization, Spring-Back Simulation, Stamping

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* - Corresponding Author

References

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