Mechanical and Thermal Properties of Liquefied Corn Bran-Based Epoxy Resins

Wen Ming Zhang; Wen Shuo Wu; Zhi Qiang Liu; Xiao Wei Li; Yu Cang Zhang

doi:10.4028/www.scientific.net/AMM.587-589.212

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 587-589Mechanical and Thermal Properties of Liquefied...

Mechanical and Thermal Properties of Liquefied Corn Bran-Based Epoxy Resins

Abstract:

Corn bran was liquefied in phenol catalyzed by sulfuric acid at 120-180 °C. The liquefaction product (LCB) had groups of bound phenol and was considered as a precursor for synthesizing corn bran-based epoxy resin (LCBER). Namely, the phenolic OH groups of LCB reacted with epichlorohydrin under alkali condition. The structure and average molecular weights of LCB and LCBER in various reaction conditions were examined by FT-IR and GPC. Epoxy functionality was introduced to LCB and the extreme high molecular weight portion of LCBER-30 was obtained using LCB at 30 min as raw materials. LCBER was cured with polyamide-650 (PA-650) and the thermal and mechanical properties were evaluated. Comparing to the petroleum-based bisphenol-A type epoxy resin (DGEBA), LCBER presented higher adhesive shear strength and good thermal stability. These suggested that LCBER would be more suitable to glue biomass materials.

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Periodical:

Applied Mechanics and Materials (Volumes 587-589)

Pages:

212-215

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.587-589.212

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Online since:

July 2014

Authors:

Wen Ming Zhang, Wen Shuo Wu, Zhi Qiang Liu*, Xiao Wei Li, Yu Cang Zhang

Keywords:

Biomaterial, Corn Bran, Epoxy Resin (ER), Liquefaction, Thermogravimetricanalysis

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* - Corresponding Author

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