Non-Melt Ultrasonic Bonding Method for Polymer MEMS Devices

Zong Bo Zhang; Qing Qiang He; Cao Qing Yan

doi:10.4028/www.scientific.net/AMM.607.133

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 607Non-Melt Ultrasonic Bonding Method for Polymer...

Non-Melt Ultrasonic Bonding Method for Polymer MEMS Devices

Abstract:

Based on the theoretical study in our previous work, a novel thermal assisted ultrasonic bonding method for polymer Micro/nanoElectro-Mechanical Systems (M/NEMS) has been demonstrated. Bonding experiments of PMMA microfluidic chips with micro-channel of 80 μm in depth and width were conducted. The result shows numerous superiorities of this method including high bonding strength (0.95 MPa), low dimension loss (0.8% in depth and 0.3% in width, respectively) and short bonding duration.

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Periodical:

Applied Mechanics and Materials (Volume 607)

Pages:

133-138

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.607.133

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Online since:

July 2014

Authors:

Zong Bo Zhang*, Qing Qiang He, Cao Qing Yan

Keywords:

MEMS Device, Tensile Strength, Ultrasonic Bonding

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* - Corresponding Author

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