Development of Automatic Wafer Centering System for Vacuum Transfer Robot Using for Semiconductor Manufacturing

Myung Jin Chung; Sung Jik Lee

doi:10.4028/www.scientific.net/AMM.607.782

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 607Development of Automatic Wafer Centering System...

Development of Automatic Wafer Centering System for Vacuum Transfer Robot Using for Semiconductor Manufacturing

Abstract:

The automatic wafer centering system having the function as wafer slip is measured and arm is controlled to compensate the wafer position error by slip is proposed. Two dimensional positions to compensate the wafer slip from measured sensor signal are calculated by using the compensation algorithm. Automatic wafer centering system is developed and verification test is conducted. In the verification test, developed automatic wafer centering system has measurement accuracy of under 0.2mm for radial and tangential direction.

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Periodical:

Applied Mechanics and Materials (Volume 607)

Pages:

782-785

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.607.782

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Online since:

July 2014

Authors:

Myung Jin Chung*, Sung Jik Lee

Keywords:

Automatic Wafer Centering, Semiconductor, Transfer Robot, Vacuum, Wafer Slip

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* - Corresponding Author

References

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