Research of Signal Integrality in PCB Design for ARM9 Core Board

Abstract:

To solve the signal integrity problem which exists in ARM9 core PCB board design is the foundation to ensure high-speed ARM9 embedded system’s security and reliability. This paper make research on reflection, crosstalk and timing issues which exist in the design process of the ARM9 embedded system core PCB board, and perform simulation with the help of Cadence simulation and analysis software and IBIS model. The results show that match impedance is the key to solve the reflection problem,appropriate length and line spacing is help to solve the crosstalk problem,make the clock lines and data lines isometric can effectively reduce the timing issues.

• Periodical: Applied Mechanics and Materials (Volumes 644-650)
• Pages: 3497-3500
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.644-650.3497
• Online since: September 2014
• Authors: Liang Yu Su*
• Keywords: ARM9 Embedded System, Cadence, Core PCB Board, IBIS Model, Signal Integrity

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