Study on Swelling Solution for High Tg Epoxy Resin Substrate

Abstract:

A new type of swelling solution is developed, which is applied for the pre-treatment of plating-through-hole (PTH) of print circuit board (PCB) made up of high Tg epoxy resin substrates. The results show that the best formula is 144 organic esters 200g/L and hexylene glycol 2g/L. The treatment temperature and processing time is 60°C and 6min, respectively. Under the optimal conditions, the residue caused by drilling can be removed completely through the process including swelling, oxidation and neutralization.

• Periodical: Applied Mechanics and Materials (Volumes 66-68)
• Pages: 90-95
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.66-68.90
• Online since: July 2011
• Authors: Guo Fang Han, Jian Hua Shi, Zhi Dong Chen
• Keywords: Desmear, High Tg Epoxy Resin Substrate, Print Circuit Board, Swelling Solution

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