Study on Swelling Solution for High Tg Epoxy Resin Substrate

Abstract:

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A new type of swelling solution is developed, which is applied for the pre-treatment of plating-through-hole (PTH) of print circuit board (PCB) made up of high Tg epoxy resin substrates. The results show that the best formula is 144 organic esters 200g/L and hexylene glycol 2g/L. The treatment temperature and processing time is 60°C and 6min, respectively. Under the optimal conditions, the residue caused by drilling can be removed completely through the process including swelling, oxidation and neutralization.

Info:

Periodical:

Edited by:

Honghua Tan

Pages:

90-95

DOI:

10.4028/www.scientific.net/AMM.66-68.90

Citation:

G. F. Han et al., "Study on Swelling Solution for High Tg Epoxy Resin Substrate", Applied Mechanics and Materials, Vols. 66-68, pp. 90-95, 2011

Online since:

July 2011

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Price:

$35.00

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