Effect of Ag on the Sn-Cu Lead-Free Material

Zhi Gang Kong; Feng Min Shi

doi:10.4028/www.scientific.net/AMM.687-691.4291

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 687-691Effect of Ag on the Sn-Cu Lead-Free Material

Effect of Ag on the Sn-Cu Lead-Free Material

Abstract:

With the increasing focus on developing environmentally benign electronic packages, Pb-free alloys have received a great deal of attention. Among the lead-free solder materials, Sn–Ag–Cu alloy has advantages of good wetting property, superior interfacial properties, high creep resistance and low coarsening rate. In this article, the organization and mechanical performance of Sn-Ag-Cu Material are investigated. Series of inspections and analytical research methods are introduced. Experimental results show that Sn-Cu solder organization contains a large number of Cu₆Sn₅ graphic, while Sn-Ag-Cu graphic is IMC Ag₃Sn graphic. The mechanical propersity of Sn-Ag-Cu alloy is better than the Sn-Cu alloy. Fracture surfaces of the Sn-Ag3.0-Cu0.5 alloys specimen have many small size and homogeneously distributed dimples.

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Periodical:

Applied Mechanics and Materials (Volumes 687-691)

Pages:

4291-4294

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.687-691.4291

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Online since:

November 2014

Authors:

Zhi Gang Kong*, Feng Min Shi

Keywords:

IMC, Lead-Free Solder, Organization, Welding Performance

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References

[1] C.M. Gourlay, K. Nogita, and S.D. McDonald: Scripta Materialia, Vol. 54(2010), p.1557.

Google Scholar

[2] T. Ventura, K. Nogita: Journal of Electronic Materials Vol. 37(2008), p.32.

Google Scholar

[3] C.M. Gourlay, J. Read, and K. Nogita: Journal of Electronic Materials, Vol. 37(2012), p.51~60.

Google Scholar

[4] K. Nogita, C.M. Gourlay: Materials Transactions, Vol. 49(2008), p.443.

Google Scholar

[5] H.L. Pang, B.S. Xiong and T.H. Low: International Journal of Fatigue Vol. 26(2004), p.865.

Google Scholar

[6] W. YoonJ, Y.H. Lee and D.G. Kim: Journal of Alloys and Compounds, Vol. 381(2004), p.151.

Google Scholar

[7] A. Zribi, A. Clark and L. Zavalij: Journal of Electronic Materials Vol. 30(2001), p.1157.

Google Scholar

[8] S.H. Kim, J.M. Kim and S. Yoo: Original Research Article Current Applied Physics, Vol. 13(2013), p.103.

Google Scholar

[9] K.M. Young, J.K. Tae and Y. C Min: Journal of Alloys and Compounds Vol. 575(2013), p.350.

Google Scholar

[10] E.H. Amalu, W.K. Lau and N.N. Ekere: Microelectronic Engineering Vol. 88(2011), p.1610.

Google Scholar

[11] H. Naoyuki, U. Tokuteru and T. Yorinobu: Journal of Alloys and Compounds Vol. 527 (2012), p.226.

Google Scholar

[12] K. Nogita, J. Read and T. Nishimura: Materials Transactions Vol. 46(2005), p.2419.

Google Scholar

[13] K. Fakpan, Y. Otsuka and Y. Mutoh: Procedia Engineering, Vol. 10(2011), p.1238.

Google Scholar

[14] L. Jiang, N. Chawla: Scripta Materialia Vol. 63 (2010), p.480.

Google Scholar

[15] H. Nishikawa, J.Y. Piao and T. Takemoto: Journal of the Japan Institute of Metals Vol. 70 (2011), p.427.

Google Scholar

[16] H. Nishikawa, J.Y. Piao and T.: Vol. 35(2006), p.1127.

Google Scholar

[17] D. Ma, W.D. Wang and S.K. Lahiri: Journal of Applied Physics Vol. 91(2012), p.3312.

Google Scholar