Effect of the Ratio of Si-H/C=C on the Properties of Organosilicone Gel Materials for Large-Power LED Encapsulation

Ran Yan; Pan Xiang; Yan Fang Cheng; Chao Jin Yang; Yang Li; Ming Shan Yang

doi:10.4028/www.scientific.net/AMM.692.261

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 692Effect of the Ratio of Si-H/C=C on the Properties...

Effect of the Ratio of Si-H/C=C on the Properties of Organosilicone Gel Materials for Large-Power LED Encapsulation

Abstract:

The organosilicone gel material for large-power LED packaging was prepared through Si-H addition reaction of hydrogen-silicone with vinyl-silicone catalyzed by Pt coordination compound in the paper. The effect of Si-H/C=C ratio on thermal stability, shore hardness, visible light transmittance and tensile properties were investigated by FTIR, UV-vis spectrometer, etc., which supplied the basic data for the preparation and application of organosilicone materials for large-power LED packaging.

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Periodical:

Applied Mechanics and Materials (Volume 692)

Pages:

261-266

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.692.261

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Online since:

November 2014

Authors:

Ran Yan, Pan Xiang, Yan Fang Cheng, Chao Jin Yang, Yang Li, Ming Shan Yang*

Keywords:

Encapsulation, Large-Power Light-Emitting Diode, Silicone Gel Materials

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* - Corresponding Author

References

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