Effect of Different Curing Catalysts on Curing Behavior of Transparent Epoxy Molding Compound for SMD LED Packaging

Yan Fang Cheng; Ying Zhou; Ran Yan; Yuan Kai Chen; Ming Liang; Yang Jie Lin; Ming Shan Yang

doi:10.4028/www.scientific.net/AMM.692.272

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 692Effect of Different Curing Catalysts on Curing...

Effect of Different Curing Catalysts on Curing Behavior of Transparent Epoxy Molding Compound for SMD LED Packaging

Abstract:

The transparent epoxy molding compound (EMC) for integrated circuits (IC) packaging was prepared by using tetrahydromethyl-1,3-isobenzofurandione as curing agent, respectively using 2-methyl imidazole and triphenyl phosphine as curing accelerator. The effect of curing accelerator type on curing behavior of EMC was investigated by non-isothermal DSC method in this paper. Based on Kissinger method, Crane method and Ozawa method, the kinetic parameters such as activation energy and reaction order of the curing reaction were obtained. The characteristic temperatures of the curing process such as gel temperature, curing temperature and post-curing temperature were calculated by extrapolation. The results showed that EMC with 2-methyl imidazole had a lower activation energy compared to EMC with triphenyl phosphine, which provided the basic data for the optimal recipe of EMC and the determination of IC packaging technologies.

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Periodical:

Applied Mechanics and Materials (Volume 692)

Pages:

272-276

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.692.272

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Online since:

November 2014

Authors:

Yan Fang Cheng, Ying Zhou, Ran Yan, Yuan Kai Chen, Ming Liang, Yang Jie Lin, Ming Shan Yang*

Keywords:

Light-Emitting Diode (LED), Non-Isothermal Curing Kinetics, Transparent Epoxy Molding Compounds (EMC)

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