Study of the Effects of Cutting Parameters on Poly-Silicon Nano Machining

Ying Zhu; Zhi Xiang; Ling Ling Xie; Yin Cheng Zhang; Jian Cun Zhao

doi:10.4028/www.scientific.net/AMM.697.369

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 697Study of the Effects of Cutting Parameters on...

Study of the Effects of Cutting Parameters on Poly-Silicon Nano Machining

Abstract:

The current status of nanofabrication briefly reviewed, then molecular dynamics model of poly-silicon is founded on micro-nanoscale with molecular dynamics method, in which several typical defects are distributed reasonably. Molecular dynamics simulation of nanocutting process is conducted according to the simulation model. Keeping the other conditions remain unchanged, simulating calculation is made by reasonably changing cutting parameters such as cutting velocity and cutting depth, through which the changes of the morphology structure of workpiece surface,cutting force and system potential energy are observed. The simulation results are compared and studied, then the influence laws of each parameter on morphology structure of workpiece surface, cutting force and system potential energy are analyzed. Based on this, the mechanism of poly-silicon nanomachining is discussed .

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Periodical:

Applied Mechanics and Materials (Volume 697)

Pages:

369-372

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.697.369

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Online since:

November 2014

Authors:

Ying Zhu*, Zhi Xiang, Ling Ling Xie, Yin Cheng Zhang, Jian Cun Zhao

Keywords:

Cutting Parameters, Molecular Dynamic (MD), Nanomachining, Poly-Silicon

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* - Corresponding Author

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