Experimental and Numerical Analysis of Thermal Deformation in Thermoelectric Coolers

Wei Chung Wang; Ting Ying Wu

doi:10.4028/www.scientific.net/AMM.70.399

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 70Experimental and Numerical Analysis of Thermal...

Experimental and Numerical Analysis of Thermal Deformation in Thermoelectric Coolers

Abstract:

In this paper, the electronic speckle pattern interferometry (ESPI) and the finite element method (FEM) were used to obtain the thermal deformation induced in a centrally supported thermoelectric cooler (TEC). The results of ESPI and FEM are in good agreement and show that the warpage varies linearly with respect to the temperature difference between the two ceramic plates inside the TEC.

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Periodical:

Applied Mechanics and Materials (Volume 70)

Pages:

399-404

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.70.399

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Online since:

August 2011

Authors:

Wei Chung Wang, Ting Ying Wu

Keywords:

Electronic Speckle Pattern Interferometry (ESPI), Finite Element Model (FEM), Thermal Deformation, Thermoelectric Cooler

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References

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