Experimental and Numerical Analysis of Thermal Deformation in Thermoelectric Coolers

Abstract:

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In this paper, the electronic speckle pattern interferometry (ESPI) and the finite element method (FEM) were used to obtain the thermal deformation induced in a centrally supported thermoelectric cooler (TEC). The results of ESPI and FEM are in good agreement and show that the warpage varies linearly with respect to the temperature difference between the two ceramic plates inside the TEC.

Info:

Periodical:

Edited by:

R. L. Burguete, M. Lucas, E. A. Patterson, S. Quinn

Pages:

399-404

DOI:

10.4028/www.scientific.net/AMM.70.399

Citation:

W. C. Wang and T. Y. Wu, "Experimental and Numerical Analysis of Thermal Deformation in Thermoelectric Coolers", Applied Mechanics and Materials, Vol. 70, pp. 399-404, 2011

Online since:

August 2011

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$35.00

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