Research on the Failure Characteristics of Porous Ceramic Capacitor Based on Numerical Simulation Technology

Abstract:

In the electronics industry, people has higher and higher demand for the performance of electronic products, but the requirement of volume is more and more small, it will promote the electronic products toward the direction of miniaturization. Porous ceramic capacitor is one of the most commonly used small electronic devices, but the capacitor thermal failure problem is always a difficult problem plagued capacitor design. This paper establishes the mathematical model of porous ceramic capacitors failure stress, and ABAUQS software is introduced to the failure simulation calculation process of porous ceramic capacitor, to establish the numerical simulation model of capacitor. Through the boundary conditions, the capacitor’s maximum failure stress are calculated, the failure force and the relationship between the thickness of dielectric layer and ceramic layer are obtained, which provide a new computer method for the design of porous ceramic capacitor and the study.

• Periodical: Applied Mechanics and Materials (Volumes 716-717)
• Pages: 1212-1216
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.716-717.1212
• Online since: December 2014
• Authors: Yang Chao*
• Keywords: ABAQUS Software, Electrolyte, Failure Characteristics, Numerical Simulation, Porous Ceramic Capacitors, Properties

References

[1] Hong Zhu, Han Jie, Zhang Ligang. Research on the diamond twelve face closed cell porous material characterization [J]. Functional materials, 2011, 41(11): 2018-(2021).

[2] Hong Zhu, Han Jiecai, Zhang Yumin, Zhang Ligang. Research on the fourteen sides closed cell porous material characterization [J]. Journal of Harbin Institute Technology, 2011, 43 (5): 56-57.

[3] Lu Zixing, Zhang Jialei. The numerical Simulation of open stretching hole elastic foam material deformation process [J]. Mechanical strength, 2012, 31 (53): 432-436.

[4] Li Ganglong, Jiang Wugui. multilayer ceramic capacitor finite element simplified model and its failure analysis [J]. Failure analysis and prevention, 2011(1): 8-11.

[5] Wang Junbo. The multilayer ceramic capacitors technology situation and its future development trend [J]. Insulation materials, 2012, 41 (3): 30-32.

[6] Li Shilan, Bao Shengxiang, Peng Jing, et al. The common microcosmic mechanism of causing MLCC failure [J]. Electronic components and materials, 2012(5): 59-61.

[7] Lu Mori art, Liu Xin, Xiao Peiyi. Analysis of the several cracking Ni electrode multilayer ceramic capacitors factors [J]. Green quality engineering, 2011(9): 35-37.

[8] Liu Xuejie, Ma Qinfang. The finite element simulation of Ti-Si-N super hard composite surface nano indentation process [J]. Materials review, 2011(4): 73-76.

[9] Yang Jianming, Feng Xiujuan, Hao Jie, Ren Zhenzhong, Ma Qinfang. The numerical simulation of the elastic cushion in the spherical surface multi point forming for the inhibition indentation [J]. Nanjing: mechanical manufacturing and automation, 2010 (3): 112-113.

[10] Lu Zixing, Huang Jixiang, Chen Xin. The elastic properties of anisotropic Kelvin open cell foam model [J]. Journal of Air, 2011, 30 (6): 1017-1022.

[11] Lu Zixing, Chen Xin, Zhang Jialei. The numerical simulation of anisotropic elastic open cell foam compression behavior [J]. Journal of Beihang University, 2012, 34 (5): 564-567.

[12] Zhang Yumin, Hong Zhu, Han Jiecai, Zhang Ligang. Research on the transparent metallic mesh electromagnetic shielding layer material preparation and properties [J]. Ordnance material science and engineering, 2011, 30 (2): 8-10.