Mechanical Engineering and Materials Science

Mechanical Engineering and Materials Science

Description:

Collection of selected, peer reviewed papers from the 2014 International Conference on Intelligent Mechanics and Materials Engineering (ICIMME 2014), December 27-28, 2014, Shenzhen, China. The 378 papers are grouped as follows:
Chapter 1: Materials Science and Processing Technologies, Chemical Processes and Biotechnologies;
Chapter 2: Construction and Structural Engineering, Materials and Technologies;
Chapter 3: General Mechanical Engineering, Applied Mechanics and Manufacturing, Equipment;
Chapter 4: Measurements, Instrumentation, Testing, Monitoring, Analysis and Detection Technologies;
Chapter 5: Electronics and Microelectronics, Embedded and Integrated Systems, Communications and Signal Processing, Power and Energy, Electric and Magnetic Systems;
Chapter 6: Mechatronics, Robotics, Automation and Control

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Info:

Editors:
M.R. Xue, K.M. Li, M.H. Lee and X.Y. Zhang
THEMA:
TGB, TGM
BISAC:
TEC000000
Details:
Selected, peer reviewed papers from the 2014 International Conference on Intelligent Mechanics and Materials Engineering (ICIMME 2014), December 27-28, 2014, Shenzhen, China
Pages:
1788
Book Set:
2 Books set
Year:
2015
ISBN-13 (softcover):
9783038353867
ISBN-13 (CD):
9783038590880
ISBN-13 (eBook):
9783038267713
Permissions CCC:
Permissions PLS:
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Review from Ringgold Inc., ProtoView: Editors Xue, Li, Lee, and Zhang present students, academics, researchers, and engineering and other professionals working in a wide variety of manufacturing contexts with a two-volume collection of peer-reviewed scholarly papers and academic articles selected from research presented at the International Conference on Intelligent Mechanics and Materials Engineering held in December of 2014 in Shenzhen, China. The contributions that make up the main body of the text are organized in six chapters. The first volume includes chapters devoted to materials science and processing technologies, chemical processes, and biotechnologies, and other related subjects. The second volume includes chapters focused on electronics and microelectronics, embedded and integrated systems, communications and signal processing, power and energy, electric and magnetic systems, and other related subjects.

Ringgold Subjects:

— Engineering
— Materials science
— Mechanical engineering