Analysis of Thermoelastic Damping in Bilayered Circular Microplate Resonators

Wan Li Zuo; Pu Li

doi:10.4028/www.scientific.net/AMM.716-717.785

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 716-717Analysis of Thermoelastic Damping in Bilayered...

Analysis of Thermoelastic Damping in Bilayered Circular Microplate Resonators

Abstract:

Predicting thermoelastic damping is essential in the design of the next generation of layered composite microresonators. We present an analytical model for thermoelastic damping in circular microplates using the framework developed by Bishop and Kinra. The thermoelastic damping spectrum will exhibit two distinct peaks when the thermal conductivity of the substrate is much greater or less than that of the film. Increment of the thickness of a layer with the bigger Zener’s modulus will increase the peak damping.

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Periodical:

Applied Mechanics and Materials (Volumes 716-717)

Pages:

785-789

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.716-717.785

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Online since:

December 2014

Authors:

Wan Li Zuo*, Pu Li

Keywords:

Bilayered, Circular Microplates, MEMS Resonators, Thermoelastic Damping

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