Multi-Layer Micro Channels System: Interpretation and Developments

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During the last three decades the concept of the traditional cooling systems was modified to include single, double, and multi-layer micro channels. The new studies, applications, fabrication, and research focus on four main areas: the geometrical shape of the micro channels, the number of stacked layers, the type of the coolants, and the heat performance optimization. The previous studies have shown a significant reduction in the power consumption as the optimization is accomplished. In this paper, a semi-review for the previous works is provided, an attempt to interpret the nature of the work done, and show another trial for optimization. In this study, water was used as coolant, stacked multi-channel was adopted, and thermal resistance network was calculated. The heat sink under consideration is a rectangle of width W and length L. The thickness Hsub of the base of the micro-channel is 100 [μ m] while the depth Hc of the micro-channel is 500[μ m], both kept constant for all future optimization cases.

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171-175

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January 2016

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© 2016 Trans Tech Publications Ltd. All Rights Reserved

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[1] B. Tuckerman and R. F. W. Pease, High-performance heat sinking for VLSI, IEEE Electron Device Letters, EDL-2 No. 5 (1981) 126-9.

DOI: 10.1109/edl.1981.25367

Google Scholar

[2] N. Goldberg, Narrow channel forced air heat sink, IEEE Trans. Comp. Hybrids Manuf. Technol., CHMT-7 (1984) 154-159.

DOI: 10.1109/tchmt.1984.1136326

Google Scholar

[3] M. Mahalingam, Thermal management in semiconductor device packaging, Proc. IEEE. 73 (1985) 1396-1404.

DOI: 10.1109/proc.1985.13300

Google Scholar

[4] G.A. Quadir, A. Mydin, and K.N. Seetharamu, Analysis of microchannel heat Exchangers using FEM, International Journal of Numerical Methods for Heat Fluid Flow, 11No. 1(2000) 59-76.

DOI: 10.1108/09615530110364097

Google Scholar

[5] Qu, W. and I. Mudawar , Analysis of three-dimensional heat transfer in micro channel heat sinks, International Journal Heat and Mass Transfer, 45 (2002) 3973–85.

DOI: 10.1016/s0017-9310(02)00101-1

Google Scholar

[6] B.D. Shao, L.F. Wang, Li. Jianyun and H. M Cheng. (2013), Multi-objective optimization design of multi-layer rectangle micro-channel heat sink for single-phase flow and heat transfer, Advance Materials Research, 709 (2013) 286-291.

DOI: 10.4028/www.scientific.net/amr.709.286

Google Scholar

[7] B. D Shao, L.F. Wang, Li Jianyun and Z.W. Sun, Application of thermal resistance network model in optimization design of micro-channel cooling heat sink, International Journal of Numerical Methods for Heat Fluid Flow, 19 (2009) 535–45.

DOI: 10.1108/09615530910938425

Google Scholar

[8] S.G. Kandlikar and W.J. Grande , Evaluation of single phase flow in micro channels for high flux chip cooling , Thermo hydraulic performance enhancement and fabrication technology, Heat Transfer Engineering, 25 (2004 ) 5-16.

DOI: 10.1080/01457630490519772

Google Scholar

[9] D. Liu and S.V. Garimella , Analysis and optimization of the thermal performance of micro channel heat sinks, Intern. Journ. of Numerical Methods for Heat & Fluid Flow, 15 (2005)7-26.

DOI: 10.1108/09615530510571921

Google Scholar

[10] K. Vafai and L. Zhu, Analysis of two-layered micro-channel heat sink concept in electronic cooling, International Journal of Heat and Mass Transfer, 42 (1999 ) 2287-2297.

DOI: 10.1016/s0017-9310(98)00017-9

Google Scholar

[11] P. Skandakumaran, A. Ortega, T. Jamal-Eddine , Multi-layered SiC microchannel heat sink-modeling and experiment, International Society Conference on Thermal Phenomena, (2004)352-60.

DOI: 10.1109/itherm.2004.1319196

Google Scholar

[12] M.L. Levac, H.M. Soliman, and S.J. Ormiston, Three-dimensional analysis of fluid flow and heat transfer in single- and two-layered micro-channel heat sinks, Heat and Mass Transfer, 47 (2011) 1375-83.

DOI: 10.1007/s00231-011-0795-7

Google Scholar

[13] B.D. Shao, L.F. Wang, Li. Jianyun and H. M Cheng, Optimization and Numerical Simulation of Multi-layer Micro channel Heat Sink", Procedia Engineering 31(2012) 928 – 933.

DOI: 10.1016/j.proeng.2012.01.1123

Google Scholar

[14] X. J. Wei and Y. Joshi, Optimization Study of Stacked micro-Channel Heat Sinks for Micro-Electronic Cooling, IEEE Transactions on Components and Packaging Technologies, 26(2003) No. 1.

DOI: 10.1109/tcapt.2003.811473

Google Scholar

[15] X.J. Wei and Y. Joshi , Stacked Micro channel Heat Sinks for Liquid Cooling of Microelectronic Components, Journal of Electronic Packaging, Transactions of the ASME, 126 (2004).

DOI: 10.1115/1.1647124

Google Scholar

[16] B. D Shao, Z.W. Sun, and L.F. Wang, Optimization design of micro channel cooling heat sink, International Journal of Numerical Methods for Heat & Fluid Flow, 17 (2007) 628-37.

DOI: 10.1108/09615530710761243

Google Scholar

[17] N. Lei, P. Skandakumaran, A. Ortega, Experiments and Modeling of Multilayer Copper Mini channel Heat Sinks in Single-Phase Flow, IEEE (2006).

DOI: 10.1109/itherm.2006.1645318

Google Scholar