Creep Characteristic of Sn1.0Ag0.7Cu Lead-Free Solders with Element Addition

Fumio Ogawa; Hiroki Nagao; Takamoto Itoh; Masao Sakane; Mitsuo Yamashita; Hiroaki Hokazono

doi:10.4028/www.scientific.net/AMM.853.192

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 853Creep Characteristic of Sn1.0Ag0.7Cu Lead-Free...

Creep Characteristic of Sn1.0Ag0.7Cu Lead-Free Solders with Element Addition

Abstract:

In this study, creep properties of lead-free solders based on Sn1.0Ag0.7Cu were investigated. In the solders, germanium, nickel and bismuth were added to improve their mechanical properties. The effect of element addition on their microstructure and creep properties were studied. Creep properties were improved with the element addition. Creep rupture lifetime was the longest for SnAgCuBiNiGe, and that of SnAgCuBi was the second longest. It was made clear that a minimum creep strain rate is useful for lifetime prediction of the solders. An observation of microstructure was performed and coarsening of intermetallics after creep test was identified, resulting in creep rupture. It was found that the addition of bismuth hinders the coarsening of intermetallics and is effective to improve the creep properties of the solders.

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Periodical:

Applied Mechanics and Materials (Volume 853)

Pages:

192-196

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.853.192

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Online since:

September 2016

Authors:

Fumio Ogawa*, Hiroki Nagao, Takamoto Itoh, Masao Sakane, Mitsuo Yamashita, Hiroaki Hokazono

Keywords:

Creep, Lead-Free Solder, Life Prediction, Microstructure

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