Finite Element Model for Cracked Beams with Bonded Piezoelectric Transducers

Article Preview

Abstract:

Based on the finite element software ANSYS, an electromechanical impedance (EMI) model for a cracked beam with imperfectly bonded piezoelectric patches is established in the paper. The property of bonding layer between the PZT sensor/actuators and the host beam is taken into account and thus the three-dimensional (3D) model of piezoelectric patch-adhesive-cracked beam coupled system is developed. Comparison with existing numerical results validates the effectiveness and accuracy of the present analysis. Then, parameter study is conducted by considering effects of the vibration mode of the host beam, the mass density of the adhesive and crack depth etc. on EMI signatures. The numerical results indicate that the present EMI model can be used to detect the cracks in the structures.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

73-76

Citation:

Online since:

September 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] V.G.M. Annamdas and C.K. Soh: Three-Dimensional Electromechanical Impedance Model for Multiple Piezoceramic Transducers-Structure Interaction, J. Aeros. Eng. Vol. 21 (2008), p.1.

DOI: 10.1061/(asce)0893-1321(2008)21:1(35)

Google Scholar

[2] V.G.M. Annamdas and C.K. Soh: An Electromechanical Impedance Model of a Piezoceramic Transducer-Structure in the Presence of Thick Adhesive Bonding, Smart Mater. Struct. Vol. 16 (2007), p.673–686.

DOI: 10.1088/0964-1726/16/3/014

Google Scholar

[3] W. Yan, J.B. Cai and W.Q Chen.: Monitoring Interfacial Defects in a Composite Beam using Impedance Signatures, J. Sound Vib. Vol. 326 (2009), pp.340-352.

DOI: 10.1016/j.jsv.2009.04.030

Google Scholar

[4] W. Yan, W.Q. Chen, C.W. Lim and B. Cai: Application of EMI Technique for Crack Detection in Continuous Beams Adhesively Bonded with Multiple Piezoelectric Patches, Mech. Adv. Mater. Struc. Vol.15 (2008), pp.1-11.

DOI: 10.1080/15376490701410513

Google Scholar

[5] Y. Chen: Research on Piezoelectric Impedance Tchnology for Structural Health Monitoring, Master's thesis. Zhejiang University, Hangzhou, China, (2010).

Google Scholar

[6] T. Makkonen, A. Holappa, J. Ella and M.M. Salomaa: Finite Element Simulations of Thin-film Composite BAW Resonators IEEE Transducers, Ultrason. Ferroelectr. Freq. Control. Vol.48 (2001), p.41–58.

DOI: 10.1109/58.949733

Google Scholar

[7] X.P. Mo: Simulation and Analysis of Acoustics Transducers using the ANSYS Software, Tech. Acoust. Vol. 26 (2007), pp.1279-1290.

Google Scholar