The Higher Order Crack Tip Fields for Interfacial Crack between Linear Functionally Graded and Homogeneous Piezoelectric Materials
The higher order crack-tip fields for an anti-plane crack situated in the interface between functionally graded piezoelectric materials (FGPMs) and homogeneous piezoelectric materials (HPMs) are presented. The mechanical and electrical properties of the FGPMs are assumed to be linear functions of y perpendicular to the crack. The crack surfaces are supposed to be insulated electrically. By using the method of eigen-expansion, the higher order stress and electric displacement crack tip fields for FGPMs and HPMs are obtained. The analytic expressions of the stress intensity factors and the electric displacement intensity factors are derived.
Z.S. Liu, L.P. Xu, X.D. Liang, Z.H. Wang and H.M. Zhang
Y. Dai et al., "The Higher Order Crack Tip Fields for Interfacial Crack between Linear Functionally Graded and Homogeneous Piezoelectric Materials", Advanced Materials Research, Vol. 1015, pp. 97-100, 2014