Applied Technology in Printed Circuit Board Inspection Base on Connected Components Matching and Analysis

Cheng Yong Zheng

doi:10.4028/www.scientific.net/AMR.1022.188

Paper Titles

The Property Analysis of the Leaf Spring Based on Abaqus and Elastic Mechanics
p.159

Research on Electromagnetic Environment of Transmission Line
p.165

Applied Technology in Road Identification Study of Off-Road Vehicle
p.169

Signal Detection Technology in Shipboard Power System with Grounding Fault Line Selection by Current Travelling Waves Based on Mathematical Morphology
p.182

Applied Technology in Printed Circuit Board Inspection Base on Connected Components Matching and Analysis
p.188

Research on Optical Signal Carrier Transmission Technology
p.193

Design of Embedded Control System for Window-Cleaning Robot
p.197

The Overview on Sticking Breakout Behavior for Thin Slab Continuous Casting
p.201

Research on Information Process with a Computational Approach to Some Odd-Graceful Trees
p.207

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1022Applied Technology in Printed Circuit Board...

Applied Technology in Printed Circuit Board Inspection Base on Connected Components Matching and Analysis

Abstract:

Template based printed circuit board (PCB) inspection needs aligning the test image to the reference image, but most of the current image alignment methods are very time-consuming. In order to improve the efficiency of PCB inspection, we put forward an image alignment algorithm based on connected components matching, and design a procedure to detect defects and classify defects. Experimental results show that the proposed method achieves good results for real single layer, bare PCB inspection.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 1022)

Pages:

188-192

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1022.188

Citation:

Cite this paper

Online since:

August 2014

Authors:

Cheng Yong Zheng*

Keywords:

Connected Components Matching, Defects Classification, Image Processing, Printed Circuit Board Inspection

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] Madhav Moganti, Fikret Ercal, Cihan H. Dagli, and Shou Shunekawa. Automatic PCB Inspection Algorithm: A Survey. Computer vision and image understanding, 63(2)(1996): 287-313.

DOI: 10.1006/cviu.1996.0020

Google Scholar

[2] Fabiana R. Leta, Flávio F. Feliciano, Flavius P. R. Martins. Computer Vision System For Printed Circuit Board Inspection. ABCM Symposium Series in Mechatronics, Vol. 3, pp.623-632, (2008).

Google Scholar

[3] W.Y. Wu, M. J. Wang, and C. M. Liu, Automated inspection of printed circuit boards through machine vision, Computer in Industry, 28 (2), pp.103-111, (1996).

DOI: 10.1016/0166-3615(95)00063-1

Google Scholar

[4] C. -H. Yeh and D. -M. Tsai, A Rotation-Invariant and Non-Referential Approach for Ball Grid Array (BGA) Substrate Conducting Path Inspection, Adv Manuf Technol (2001) 17: 412–424.

DOI: 10.1007/s001700170159

Google Scholar

[5] Tatibana, M. H., Lotufo, R. de A., Novel Automatic PCB Inspection Technique Based on Connectivity". In: X Brazilian Symp. on Computer Graphics and Image Processing-SIBGRAPI, 97, Campos de Jordão, 1997, pp.187-194.

DOI: 10.1109/sigra.1997.625174

Google Scholar

[6] S. H Indera Putera, Z. Ibrahim. Printed Circuit Board Defect Detection Using Mathematical Morphology and MATLAB Image Processing Tools. 2010 2nd International Conference on Education Technology and Computer (ICETC). p: (v5) 359-363.

DOI: 10.1109/icetc.2010.5530052

Google Scholar

[7] Barbara Zitová, Jan Flusser. Image registration methods: a survey. Image and Vision Computing, Vol. 21, No. 11. (October 2003), pp.977-1000.

DOI: 10.1016/s0262-8856(03)00137-9

Google Scholar

[8] Noor Khafifah Khalid, Zuwairie Ibrahim. An image processing approach towards classification of defects on printed circuit board. In: Malaysia-Japan International Symposium On Advanced Technology, 2007, Kuala Lumpur.

Google Scholar