Deposition of Gold Nanoparticles on Linker-Free Silicon Substrate by Spin-Coating

Abstract:

Colloidal gold (Au) nanoparticles (NPs) deposition on silicon (Si) substrate is highly affected by the deposition technique and surface properties of the substrate. Spin-coating technique has been proven to be an efficient approach in terms of cost, time and maintaining the quality of the deposition. However, to prevent the agglomeration of NPs and obtain desirable density and distribution of NPs on the substrate, precise control of the spin-coating parameters is required. In this study colloidal Au NPs were spin-coated onto a modified, yet linker-free Si surface. By controlling the spinning speed, acceleration, dwelling time, and the volume of NPs colloidal solution, the density and distribution of the NPs on Si were optimized. Scanning electron microscope was used to investigate the NPs density in each step of the process. Results showed that the distribution of NPs on Si substrate is highly dependent on the spinning speed, duration, and acceleration rate as well as surface properties of Si substrate.

• Periodical: Advanced Materials Research (Volume 1024)
• Pages: 124-127
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1024.124
• Online since: August 2014
• Authors: Mohammad Saleh Gorji, Abdul Razak Khairunisak, Kuan Yew Cheong*
• Keywords: Gold (Au) Nanoparticles, Linker-Free Silicon, Self-Assembly, Spin-Coating

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