Cure Kinetics of High Performance Epoxy Molding Compounds

Chean Cheng Su; Cheng Fu Yang; Chien Huan Wei

doi:10.4028/www.scientific.net/AMR.1024.151

Paper Titles

Effect of Annealing Temperature of Hybrid CeO₂/TiO₂ Nanotubes on the Photocurrent
p.132

Effects of Graphene Nanopletelets on Poly(Lactic Acid)/Poly(Ethylene Glycol) Polymer Nanocomposites
p.136

Comparison on Tensile Properties of Graphene and Multi-Walled Carbon Nanotubes/Epoxy Thin Film Composites
p.140

Finite Element Analysis and Preliminary Fabrication of Flexible Membrane with Embedded Magnetic Nanoparticles
p.147

Cure Kinetics of High Performance Epoxy Molding Compounds
p.151

Glass Fibers with Multi-Functional Capabilities for Engineering and Environmental Applications
p.155

Influence of Ground Tyre Rubber Devulcanisates on Morphology and Properties of Tread Tyre Formulation
p.159

Preparation of Linear Low-Density Polyethylene-g-Poly(Acrylic Acid)-Co-Starch Hydrogel
p.163

A Spectroscopic Study on the Polymer Colour Transition for Indicating the Exposure to Ionizing Radiation
p.167

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1024Cure Kinetics of High Performance Epoxy Molding...

Cure Kinetics of High Performance Epoxy Molding Compounds

Abstract:

The reaction of EMCs with the triphenylphosphine-1,4-benzoquinone (TPP-BQ) latent catalyst also had a higher temperature sensitivity compared to the reaction of EMCs with triphenylphosphine (TPP) catalyst. In resin transfer molding, EMCs containing the TPP-BQ thermal latency accelerator are least active at a low temperature. Consequently, EMCs have a low melt viscosity before gelation, and the resins and filler are evenly mixed in the kneading process. Additionally, the rheological property, flowability, is increased before the EMC form a network structure in the molding process. The proposed kinetic model adequately describes curing behavior in EMCs cured with two different organophosphine catalysts up to the rubber state in the progress of curing.

You might also be interested in these eBooks

Advancement of Materials and Nanotechnology III

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 1024)

Pages:

151-154

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1024.151

Citation:

Cite this paper

Online since:

August 2014

Authors:

Chean Cheng Su*, Cheng Fu Yang, Chien Huan Wei

Keywords:

Cure Kinetics, Epoxy Molding Compound, Thermal Latency Catalysts

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] H.F. Mark, Encyclopedia of polymer science and technology, John Wiley & Sons, New York, USA, 3rd edition, (2007).

Google Scholar

[2] C.C. Su, C.H. Wei, C.C. Yang, Elucidating How Advanced Organophosphine Accelerators Affect Molding Compounds, Ind. & Eng. Chem. Res. 52 (2013) 2525-2536.

DOI: 10.1021/ie302347r

Google Scholar

[3] C.C. Su, C.H. Wei, B.C. Li, Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators, Adv. Mat. Sci. Eng. 2013, 391267.

DOI: 10.1155/2013/391267

Google Scholar

[4] C.C. Su, E.M. Woo, Cure Kinetics and Morphology of Amine-Curerd Tetraglycidyl-4, 4'-diaminodiphenylmethane Epoxy Blends with Polyetherimide, Polymer 36 (1995) 2883-2894.

DOI: 10.1016/0032-3861(95)94337-s

Google Scholar

[5] C.C. Su, Y.P. Huang, E.M. Woo, Curing Kinetics and Reaction-Induced Homogeneity in Networks of Poly(4-Vinyl Phenol) and Diglycidylether Epoxide Cured With Amine, Polym. Eng. Sci. 45 (2005) 1-10.

DOI: 10.1002/pen.20223

Google Scholar

[6] C.C. Su, E.M. Woo, Diffusion Controlled reaction Mechanisms during cure in Polymer/Epoxy Networks, J. Polym. Sci. Polym. Phys. 35 (1997) 2141-2150.

DOI: 10.1002/(sici)1099-0488(19970930)35:13<2141::aid-polb14>3.0.co;2-4

Google Scholar

[7] K.C. Cole, J.J. Hechler, D. Noel, A new approach to modeling the cure kinetics of epoxy/amine thermosetting resins. 2. Application to a typical system based on bis[4-(diglycidylamino)phenyl]methane and bis(4-aminophenyl) sulfone, Macromolecules 24 (1991).

DOI: 10.1021/ma00011a012

Google Scholar