Analysis of Temperature and Thermal Stress Distribution on KDP Crystal Wire Saw Slicing

Yang Jiao; Pei Qi Ge; Yu Fei Gao; Wen Bo Bi

doi:10.4028/www.scientific.net/AMR.1027.28

Paper Titles

Analysis and Simulation of Air Flow Field Surrounding Grinding Wheel
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Design and Test of Piezoelectric Tool Actuator on Ultra-Precision Machine Tool for KDP Crystals
p.16

An Optimal Method of Tool Path Generation for Radial Sinusoidal Surface
p.20

Design Method of Gear Form Grinding Machine Based on QFD and AHP
p.24

Analysis of Temperature and Thermal Stress Distribution on KDP Crystal Wire Saw Slicing
p.28

Diamond Tool Wear Reduction by Combining Ultrasonic Elliptical Vibration with Graphite Particle Atmosphere
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Tool Wear Properties of Diamond-Cutting Ferrous Metal
p.36

The Research and Development on the Material Removal Mechanism of the Ultrasonic Cutting
p.40

The Pressure Field Radiated by Cavitation Bubble in the Grinding Area of Power Ultrasonic Honing
p.44

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1027Analysis of Temperature and Thermal Stress...

Analysis of Temperature and Thermal Stress Distribution on KDP Crystal Wire Saw Slicing

Abstract:

Temperature variation of KDP crystal is an important reason for its cracking. A finite element model was constructed to analyze temperature and thermal stress distribution of KDP crystal during wire saw slicing. The results showed that the highest temperature of the crystal which was located on the sawing kerf remained stable during slicing. The temperature inside the crystal rose slowly at the start of the slicing, and then tended steady with the continued increase of sawing depth. Because of the good cooling condition during the sawing process, the overall rise in temperature was small, and the maximum thermal stress on the sawing kerf was less than the tensile strength of KDP crystal, so temperature variation during slicing had little effect on crystal cracking.