Preparation and Dielectric Properties of Cu/PVDF Composite Films

Jian Wen Zhai; Ya Jun Wang; Jian Lou Deng; Chang Gen Feng

doi:10.4028/www.scientific.net/AMR.1035.417

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1035Preparation and Dielectric Properties of Cu/PVDF...

Preparation and Dielectric Properties of Cu/PVDF Composite Films

Abstract:

nanoand micro size Cu were employed separately and investigated comparatively. Different volume fraction of Cu was added into PVDF film in order to investigate the content of filler effect on the dielectric properties of polymer composites. XRD and SEM were used to analyze the crystalline phase and microstructure of the films. The results show that two sizes of Cu have the same peak features, and with the continuous increase of the content of Cu, it disperse better in PVDF. The dielectric constant (ε) of the composite containing 16 vol% micro-CCTO filler is 16 at 100 Hz and room temperature, and its dielectric loss (tanδ) is only 0.15, which is substantially better than others. Besides, for 18 vol% nanoCu/PVDF composite tanδ is 0.25 and ε is 18 at 100 Hz. Moreover, ε and tanδ of nanoCu/PVDF composite are both higher than those of micro-Cu/PVDF. Analysis shows that the composites with nanoCu have higher dielectric constants, which is mainly from the interfacial polarization.

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Advanced Materials Research (Volume 1035)

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417-421

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https://doi.org/10.4028/www.scientific.net/AMR.1035.417

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Online since:

October 2014

Authors:

Jian Wen Zhai, Ya Jun Wang*, Jian Lou Deng, Chang Gen Feng

Keywords:

Cu Particle, Dielectric Constant, Energy Storage Density, PVDF

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