The Application of Optical Emission Spectrum in Copper Film Deposition by RF Magnetron Sputtering

Abstract:

Optical Emission Spectrum (OES) was utilized to monitor the deposition procedure of copper film byradio frequency (RF) magnetron sputtering.The plasma was found to contain Ar, Ar+, Cu and Cu+ when Argon was the working gas. The OES intensity of each composition increased with the increase of the input power of sputtering. Furthermore, intensity of Cu was higher than that ofAr, Ar+ and Cu+. The mechanical property of as-deposited Cu film was measured by scratch test method. It was found that with the increase of the input power, the adhesion strength possessed the maximum value while the square resistance decreased and surface roughness obviously. Theory calculation shows these properties were connected to kinetic energy of atoms in the plasma.

• Periodical: Advanced Materials Research (Volume 1035)
• Pages: 469-475
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1035.469
• Online since: October 2014
• Authors: Jia Jun Li, Yan Chao Shi, Hao Liu, Guang Chao Chen*
• Keywords: Adhesion Strength, Electronic Resistance, OES, Plasma Diagnose, RF Magnetron Sputtering

References

[1] A. K. Tiwari, J. P. Goss, P. R. Briddon, et al. Physica Status Solidi a-Applications and Materials Science. 209 (2012) 1697-1702.

[2] Z.B. Ma, Q.C. Wu, X.S. Shu, et al. Plasma Sci. Technol. 2 (2000) 207.

[3] Y. Prasad, V. K. Senecha, H. C. Pant, et al. Pramana. 55 (2000) 797-802.

[4] V. Margetic, A. Pakulev, A. Stockhaus, et al. Spectrochimica Acta Part B: Atomic Spectroscopy. 55 (2000) 1771-1785.

DOI: 10.1016/s0584-8547(00)00275-5

[5] J. T. Xinping Qu, Mi Zhou, Tao Chen, Qi Xie, Guoping Ru, Bing-ZongLi. Applied Physics Letters. 88 (2006) 151912.

[6] A. J. Perry. Thin Solid Films. 78 (1981) 77-94.

[7] W. Hu. China Measurement & Test. 38 (2012) 13-16.

[8] Y. W. Jianchang Li, Dan Wang , Yongkuan Li, Dechun Ba. Vacuum. 48 (2011) 1-7.

[9] Y. Z. Fen Li, Liuhe Li, Qiuyuan Lu, Jianhao Zhu. Vacuum Electronics. 3 (2011) 49-54.

[10] S. Mahapatra and H. Köppel. Physical Review Letters. 81 (1998) 3116-3119.

[11] H.R. Thorsheim, J.E. Bulter, in: Karl E. Spear, John P. Dismukes (Eds. ), Synthetic Diamond: Emerging CVD Science and Technology, JOHN WILEY & SONS, INC, A Wiley-Interscience Publication, 1993, p.203.

[12] Information on. http: /www. nist. gov/pml/data/asd. cfm.

[13] Y. C. Z. X. J. Zheng, J. M. Liu, A. D. JOURNAL OF MATERIALS SCIENCE LETTERS. 22 (2003) 743-745.

[14] J. Li and W. Beres. Wear. 260 (2006) 1232-1242.

[15] Hans R. Griem. Principles of Plasma Spectroscopy. Cambridge University Press, Cambridge, (1997).

[16] A. J. L. Michael A. Lieberman. New Jersey: John Wiley &Sons Inc. (2005) 276.

[17] Beijing: Science Press, 2010: 6. (Chao Ye, Zhaoyuan Ning, Meifu Jiang, Xuemei Wu, Yu Xin. ).

[18] F. J. Gordillo-Vázquez, M. Camero and C. Gómez-Aleixandre. Plasma Sources Science and Technology. 15 (2006) 42-51.

[19] K. A. J. Gschneidner. Solid State Physics. (New York: Academic Press, 1965: 275-426. ).