Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing

Abstract:

Additive structuring and metallization technologies like Plasmadust or Aerosol Jet printing offer many advantages for future MID applications. Both digital writing technologies enable a highly flexible design of the circuit pattern and are capable of coating 3D substrates. Currently, Aerosol Jet printing is used to generate patterns with accurate and detailed features, and line widths of 100 μm. Plasmadust provides variable coating thicknesses up to 200 μm combined with a high process speed. Hence, a combination of both technologies appears to be advantageous for a broad range of MID applications. In this paper an initial study on the interconnection of plasmadust and Aerosol Jet generated conductive structures on thermoplastic substrate materials is presented. In this context different printing strategies and process variations are evaluated.

• Periodical: Advanced Materials Research (Volume 1038)
• Pages: 43-48
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1038.43
• Online since: September 2014
• Authors: René Schramm*, Johannes Hörber, Christoph Dold, Jörg Franke
• Keywords: Additive Metallization, Aerosol Jet, Plasmadust, Structuring

References

[1] J. Franke, Ed, Räumliche elektronische Baugruppen (3D-MID): Werkstoffe, Herstellung, Montage und Anwendungen für spritzgegossene Schaltungsträger. München: Carl Hanser Verlag, (2013).

DOI: 10.3139/9783446437784.fm

[2] C. Goth, M. Müller, J. Franke, and K. Feldmann, Markt- und Technologieanalyse für räumliche elektronische Schaltungsträger (MID), in Internationales Forum Mechatronik, 2011, p.49–60.

DOI: 10.3139/9783446437784.fm

[3] Pressemitteilung LPKF Laser & Electronics AG, Garbsen, 27. Mai 2014, http: /www. lpkf. de/news/pressemitteilungen/524. htm.

[4] Rudin, B., Untersuchungen zur Herstellung von LDS-MID auf Duroplastbasis, MID-Forum, SMT Hybrid Packaging, Nuremberg, (2014).

[5] Niese, B., Laserbasierte Fertigung von dreidimensionalen Schaltungsträgern, in Fachworkshop Mechatronic Integrated Devices (MID): Neue Werkstoffe − Neue Prozesse − Neue Anwendungen, Nuremberg, (2014).

[6] J. Hoerber, C. Goth, J. Franke, and M. Hedges, Electrical Functionalization of Thermoplastic Materials by Aerosol Jet Printing, in Proceedings of the 13th Electronics Packaging Technology Conference (EPTC), Singapore, (2011).

DOI: 10.1109/eptc.2011.6184525

[7] R. Schramm and J. Franke, Electrical Functionalization of Thermoplastic Materials by Cold Active Atmospheric Plasma Technology, in Proceedings of the 15th Electronics Packaging Technology Conference (EPTC), Singapore, (2013).

DOI: 10.1109/eptc.2013.6745694

[8] M. Hedges, 3D Aerosol Jet Printing – An Emerging MID Manufacturing Process, in Proceedings of the 9th International Congress Molded Interconnect Devices, Fuerth, (2010).

[9] R. Schramm and J. Franke, Manufacturing of 3D Mechatronic Systems with Plasma Technology, in Smart Systems Integration: 8th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, Aachen: Apprimus Verlag, (2014).