Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray Method

Abstract:

A novel laser induced metallization (LIM) is developed for 3 dimensional molded interconnect devices (3D-MIDs). A special laser-activable solution is firstly sprayed on top of the substrate, followed by laser direct structuring (LDS) and the electroless plating. The metal patterns can be transferred from the CAD data on almost any complex surface. Compared to the direct LDS, our spray method has smaller linewidth (30 μm) and much more flexibility on the substrate choosing. For example, the substrate can be plastic, glass, or ceramic. In addition, the laser-activable solution on top of the substrate also plays a role of the insulator. As a result, the multilayer patterns can be made by simply repeating the spray method on the same surface. Moreover, since this method is capable of making patterns layer-by-layer, the capacitors and inductances can be direct integrated with the circuit design. In this report, a 2G/3G/4G (all-in-one) antenna is tested by using our spray method. The return loss reaches the 3:1 VSWR standard, and the radiation efficiency is larger than 60% within the operation frequency.

• Periodical: Advanced Materials Research (Volume 1038)
• Pages: 69-73
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1038.69
• Online since: September 2014
• Authors: Min Chieh Chou, Tune Hune Kao, Meng Chi Huang, Wen Hua Zhang, Wei Yu Li*, Tzi Huei Lai
• Keywords: 3D-MID, Laser Induced Metallization, Multilayer, Spray

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