Paper Titles

Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing
p.57

Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz
p.63

Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray Method
p.69

Experimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography
p.75

MID Fabricated by Ultrasonic Processing
p.83

Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation
p.89

Study of MID Technologies for Automotive Lighting and Light Signaling Devices
p.97

Design and Solder Process Optimization in MID Technology for High Power Applications
p.107

Hot Pin Pull Method – New Test Procedure for the Adhesion Measurement for 3D-MID
p.115

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1038MID Fabricated by Ultrasonic Processing

MID Fabricated by Ultrasonic Processing

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Abstract:

Electronic circuit boards have been fabricated in cycle times of a few seconds by ultrasonic fabrication. A stack of thermoplastic polymer foils with a copper layer, 20 μm in thickness, on top is transformed into a polymer carrier with separated conductor paths. This process is accomplished in cycle times of a few seconds and the required equipment is just a commercially available ultrasonic welding machine and a metal tool micro patterned, e.g., by milling.Since soldering is often not possible on a thermoplastic carrier, electronic components are joined to the conductor paths by ultrasonic welding. This is achieved by employing an anisotropic conductive foil containing metal particles providing the electrical contact normal to the foil and showing no conductivity in lateral direction. The anisotropic conductive foil also serves as glue between circuit board and electronic components.

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11th International Congress Molded Interconnect Devices – Scientific Proceedings

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Periodical:

Advanced Materials Research (Volume 1038)

Pages:

83-88

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1038.83

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Online since:

September 2014

Authors:

Werner Karl Schomburg, Ji Li, Sijie Liao, Christof Gerhardy, Johannes Sackmann

Keywords:

Circuit Boards, MID Fabrication, Ultrasonic Processing

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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