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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 1049-1050A Study on Wafer and Feature Size

A Study on Wafer and Feature Size

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Abstract:

the paper introduced the bare silicon crystal how to become a wafer .then, it told the processing of wafers to produce integrated circuits .Today, most integrated circuits (ICs) are made of silicon. every integrated circuit is tested and functional and formed a dies. At last , the article explain feature size and the number of gross die per wafer (DPW).

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Periodical:

Advanced Materials Research (Volumes 1049-1050)

Pages:

762-766

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1049-1050.762

Citation:

Cite this paper

Online since:

October 2014

Authors:

Xiao Ming Hu*

Keywords:

DPW, Feature Size, Wafer

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Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

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[9] Retrieved 2008-02-23.

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[12] Industry Agrees on first 450-mm wafer standard - EETimes. com, retrieved on October 22, (2008).

[13] . Industry Agrees on first 450-mm wafer standard - EETimes. com.

[14] . Semiconductor. net: Capability for 300 mm: Approaching Industry Goals.

[15] 450 mm: A Promise Postponed.

[16] A Simulation Study of the Cost and Economics of 450 mm Wafers.

[17] . Semiconducter. net: Optimize Wafer Thickness for 450 mm.

[18] O'Mara, William C. (1990). Handbook of Semiconductor Silicon Technology. William Andrew Inc. p.349–352. ISBN0-8155-1237-6. Retrieved 2008-02-24.