Heat Resistance Properties of an Cured ATPU/Epoxy Resin

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Thermogravimetry (TG-DTA) method was used to study the heat resistance properties and the thermal decomposition kinetics of the aromatic amine-terminated polyurethane (ATPU)/Epoxy Resin System (E-44) which includes both flexible chains and rigid structural units. The results indicate that the decomposition temperature of the cured ATPU-2/E-44 is higher than that of the cured ATPU-1.5/E-44, and thermal decomposition residual of cured ATPU-2/E-44 is higher than that of cured ATPU-1.5/E-44 system. These results denote that the cured ATPU-2/E-44 has better heat resistance. The results of decomposition kinetics showed that the decomposition reaction activity of the ATPU-2/E-44 system is higher than that of ATPU-1.5/E-44.

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127-131

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November 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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[1] Z.X. Yuan, L. Lv. Study on the latent dibasic-acyl hydrazine curing epoxy dope power with DSC, Journal of Wuhan Food engineering institute. 3 (1997) 13-17.

Google Scholar

[2] Z.Y. Zhang. Determine the crystal capacity of high polymer with DSC, Applied chemistry. 10(1997) 47-50.

Google Scholar

[3] H.M. Pan, S.J. Huang, P. Liu. Study on the UV and heat curing process of alicyclic epoxy/sulfate syetem with DSC, Chinese adhesive. 3(1994) 1-4.

Google Scholar

[4] Y.J. Feng, Y.Q. Shi, D.M. He. Study on the curing heat decomposition kinetics, J. Material science and project of high polymer. 13(1997) 30-34.

Google Scholar

[5] J. J. Y. Yuan, C.Y. Pan, R.K. Bai. The synthesization and polymerization of the spiral ring monomer and its curing reaction with epoxy resin, J. Chinese adhesive. 14(1997) 25-28.

Google Scholar

[6] S.G. Luo. The chemical structure curing reaction characteristics and aging degradation of the adhesive prepolymer in NEPE, J. Bei jing university of technology Degree paper. (1997) 4-200.

Google Scholar

[7] F. Mustata, T. Nita, I. Bicu. The curing reaction of epoxidized methyl esters of corn oil with Diels- Alder adducts of resin acids. The kinetic study and thermal characterization of crosslinked products, J. Journal of Analytical and Applied Pyrolysis. 108 (2014).

DOI: 10.1016/j.jaap.2014.04.007

Google Scholar

[8] M. Ghaffari, M. Ehsani, H. A. Khonakdar, G.V. Assche, H. Terryn. The kinetic analysis of isothermal curing reaction of an epoxy resin-glassflake nanocomposite, J. Thermochimica Acta. 549 (2012) 81-86.

DOI: 10.1016/j.tca.2012.09.021

Google Scholar

[9] M. Edelmann, G. Heinrich. Thermokinetic analysis of two-step curing reactions in melt: Part II. Investigation of polymeric model systems, J. Thermochimica Acta. 499(2010)160–165.

DOI: 10.1016/j.tca.2009.12.006

Google Scholar

[10] A.M. Shanmugharaj, S. H. Ryu. Study on the effect of aminosilane functionalized nanoclay on the curing kinetics of epoxy nanocomposites, J. Thermochimica Acta. 546(2012) 16–23.

DOI: 10.1016/j.tca.2012.07.026

Google Scholar

[11] H. Xie, W. f. Shi. Polymer/SiO2 hybrid nanocomposites prepared through the photoinitiator-free UV curing and sol–gel processes, J. Composites Science and Technology. 93(2014)90–96.

DOI: 10.1016/j.compscitech.2014.01.004

Google Scholar

[12] J. Steinhaus, B. Moeginger, M. Großgarten, M. Rosentritt, B. Hausnerova. Dielectric analysis of depth dependent curing behavior of dental resin composites, J. Dental Materials. 30(2014) 679–687.

DOI: 10.1016/j.dental.2014.03.002

Google Scholar