Preparation and Properties of Organic Silicon Atomic-Oxygen-Protection Film

Cun Hui Li; Kuo Hai Zheng; Sheng Sheng Yang; Zhong Hua Li; Dao Tan Tang

doi:10.4028/www.scientific.net/AMR.1058.290

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Preparation of Silver Nanoparticles/Graphene Composite Films by Dip-Coating Method and their Surface-Enhanced Raman Scattering Property
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Preparation and Properties of Organic Silicon Atomic-Oxygen-Protection Film
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Influence of Li, Al Substitution for Mn on Crystal Structure and Electrochemical Performance of Li_1+xMn_2-x-yAl_yO₄ Cathode Materials
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1058Preparation and Properties of Organic Silicon...

Preparation and Properties of Organic Silicon Atomic-Oxygen-Protection Film

Abstract:

Materials used on exterior spacecraft surfaces are subjected to many environmental threats which can cause degradation, atomic oxygen is one of the most threats. We prepared organic silicon atomic-oxygen-protection film using method of polymerization. This paper presented the effects on the film structure and its durability of the preparation processing, and analyzed the polymerization theory, the film structure and composition of the film. At last, we tested the film in our ground based atomic oxygen simulator, and indicated that the film worked well.

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Periodical:

Advanced Materials Research (Volume 1058)

Pages:

290-293

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1058.290

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Online since:

November 2014

Authors:

Cun Hui Li*, Kuo Hai Zheng, Sheng Sheng Yang, Zhong Hua Li, Dao Tan Tang

Keywords:

Atomic Oxygen, Plasma, Polymerization, Protection, Siloxane

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