• Registration Log In
  • For Libraries
  • For Publication
  • Open Access
  • Downloads
  • About Us
  • Contact Us
For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Committees and Sponsors
Preface
Research on 3D Reconstruction Based on a Single Image
p.3
A Heuristic Mining Algorithm Using Web Hyperlink Structure
p.11
Solution of Telecom Billing-Payment Subsystem Based on Transaction Middleware
p.17
A Novel Image Fusion Algorithm Based on Local Contrast and Improved PCNN Model
p.21
Design and Implementation of Remote PSTN-Based Data Acquisition System
p.27
Research on Distance Opening Experiment Teaching Platform
p.33
The Research of Educational Resources Sharing Model Based on Web Services
p.39
HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 108-111Committees and Sponsors

Committees and Sponsors

Article Preview
Article Preview
Article Preview

Abstract:

By email View Pdf
You might also be interested in these eBooks
Progress in Measurement and Testing View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 108-111)

Online since:

May 2010

Сopyright:

© 2010 Trans Tech Publications Ltd. All Rights Reserved

Share:

Related Articles
Citation
Add To Cart

Paper price:

After payment, you will receive an email with instructions and a link to download the purchased paper.

You may also check the possible access via personal account by logging in or/and check access through your institution.

Back
Add To Cart

This paper has been added to your cart

Back To Cart
  • For Libraries
  • For Publication
  • Insights
  • Downloads
  • About Us
  • Policy & Ethics
  • Contact Us
  • Imprint
  • Privacy Policy
  • Sitemap
  • All Conferences
  • All Special Issues
  • All News
  • Open Access Partners

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.