Experimental Studies of Submicron Polycrystalline Diamond without Binder under High Pressure and Temperature

Abstract:

This paper aims to study the sintering process and mechanical properties of submicron polycrystalline diamond (SMPD) without any secondary phases and binder materials under pressure of 7-8 GPa and 1400 °C-1800 °C, using the bi-layer assembly and the conventional assembly methods. The as prepared samples were characterized by X-ray diffraction, scanning electron microscope, and Vickers indenter hardness tests. Well sintered specimen was obtained under the condition of 8 GPa and 1600 °C using the bi-layer assembly method, and an indentation test demonstrated a Vickers hardness of 52 GPa. The graphitization of diamond was found to be an important factor determining the hardness of samples sintered using the bi-layer assembly.

• Periodical: Advanced Materials Research (Volumes 1120-1121)
• Pages: 1238-1245
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1120-1121.1238
• Online since: July 2015
• Authors: Xing Hui Yang*, Zi Li Kou, Duan Wei He, Yong Kun Wang, Wen Rui Duan, Hong Yang Chen
• Keywords: Bi-Layer Assembly, Conventional Assembly, High Pressure, High Temperature, Sintering Process, Submicron Polycrystalline Diamond

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