Liquidus and Wettablity of Lead-Free Solder Alloys

Hong Mei Wang

doi:10.4028/www.scientific.net/AMR.1120-1121.462

Paper Titles

Effect of Neodymium on the Glass-Forming Ability and Magnetic Properties of Fe-Based Bulk Amorphous Alloys
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Synthesis Photosical Properties of Silicon-Containing Cross-Linked Polymer
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Structure, Magnetoresistance and Electrical Properties of La_0.8Sr_xCa_0.2-xMnO₃ Compounds
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Effect of Pr on Wettability and Mechanical Property of Sn-0.3Ag-0.7Cu Lead-Free Solder
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Liquidus and Wettablity of Lead-Free Solder Alloys
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Investigation of Ni-Microalloyed Sn-0.5Cu Lead-Free Solders
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Phase-Field Simulation for Effect of Annealing Temperature on Oxygen Clusters’ Evolution in Silicon Wafer
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Fabrication and Characterization of Anti-Microbial and Anti-Ultraviolet Nonwoven by Electrospinning
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Investigation of Mid-Infrared Millimeter Wave Radome with Polycrystalline Magnesium Fluoride
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 1120-1121Liquidus and Wettablity of Lead-Free Solder Alloys

Liquidus and Wettablity of Lead-Free Solder Alloys

Abstract:

This paper provides a new lead-free alloys with Sn, Ni, P and Mg. The liquidus of Sn-Ni alloys, Sn-P alloys, and Sn-Mg alloys was tested. And each of element affection was analyzed. The wettablity of Sn-Ni alloys ,Sn-P alloys, and Sn-Mg alloys was tested. And each of element affection was analyzed. In addition, the comparison of the liquidus and wettablity of different alloys was gave.

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Periodical:

Advanced Materials Research (Volumes 1120-1121)

Pages:

462-465

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1120-1121.462

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Online since:

July 2015

Authors:

Hong Mei Wang

Keywords:

Alternate Alloys, Lead-Free Solder, Liquidus, Wettablity

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References

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