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Pulsed Current Electrodeposition of Mn-Cu Alloys on SUS 430 Substrate as Coating Material for SOFC Interconnect Application

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Abstract:

In the present study, several series of pulse current electrodeposition experiment have been carried out at 25 °C in various electrolyte bath under different current densities to find the suitable electrodeposition condition for fabricating Mn-Cu alloys coating. The deposition kinetic of Mn-Cu alloy was assessed from the measurement of cathodic polarization behavior in selected electrolyte bath. The uniformity of Mn-Cu alloy coating, and its composition were studied by scanning electron microscope (SEM) equipped with energy dispersive spectroscopy (EDS) analysis. The results shows that a dense, adherent, smooth and uniform Mn-Cu alloy coating can be deposited on SUS 430 substrate with relatively high deposition rate. The evaluation of coating area specific resistance (ASR) at 700 °C shows a value of 0.04 Ωcm2. This result indicates that Mn-Cu alloy is promising as alternative coating materials for SOFC interconnect.

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Periodical:

Advanced Materials Research (Volume 1125)

Pages:

131-135

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1125.131

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Online since:

October 2015

Authors:

Asep Ridwan Setiawan*, Aditianto Ramelan, Rochim Suratman, Naufal Muhammad Herwandi

Keywords:

ASR, Electrodeposition, Interconnect, Pulse, SOFC

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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