[1]
A. Pizzi, A. Stephanou Phenol-formaldehyde wood adhesives under very alkaline conditions. Part I: Behaviour and Proposed Mechanism. Holzforshung, 1994, 48, 35-40.
DOI: 10.1515/hfsg.1994.48.1.35
Google Scholar
[2]
Pizzi A; Stephanou A. Phenol-formaldehyde wood adhesives under very alkaline conditions. Part II: Esters Curing Acceleration, its Mechanism and Applied Results. Holzforshung, 1994, 48, 150-156.
DOI: 10.1515/hfsg.1994.48.2.150
Google Scholar
[3]
China State Bureau of Technical Supervision. GB 18580-2001 (Indoor decorating and refurbishing materials-Limit of formaldehyde emission of wood based panels and finishing products. Beijing: Standards Press of China, (1999).
Google Scholar
[4]
Lei H;Pizzi, A;Despres A, et al. Ester acceleration mechanisms in phenol-formaldehyde resin adhesives. J Appl Polym Sci, 2006, 100, 3075-3093.
DOI: 10.1002/app.23714
Google Scholar
[5]
Linda FL; Anthony CC. Accelerated cure of phenol-formaldehyde by the addition of cure accelerators: Studies with model compounds. J Appl Polym Sci, 2002, 86, 3256-3263.
DOI: 10.1002/app.11106
Google Scholar
[6]
Kim S; Kim HS; Kim HJ, et al. Fast curing PF resin mixed with various resins and accelerators for building composite materials. Construction and Building Materials, 2008, 22, 2141-2146.
DOI: 10.1016/j.conbuildmat.2007.07.007
Google Scholar
[7]
Higuchi M; Tohmura S; Sakata I. Acceleration of the cure of phenolic resin adhesives V: Catalytic actions of carbonates and formamide. Mokuzai Gakkaishi. 1994, 40, 604-611.
Google Scholar
[8]
Park GD; Riedl B; Hsu EW, et al. Differential scanning calorimetry of PF resins cure-accelerated by carbonates. Polym, 1999, 40, 1689-1699.
DOI: 10.1016/s0032-3861(98)00400-5
Google Scholar
[9]
Pizzi A; Garcia R; Wang S. On the networking mechanisms of additives accelerated PF polycondensates. J Appl Polym Sci, 1997, 66, 255-266.
DOI: 10.1002/(sici)1097-4628(19971010)66:2<255::aid-app6>3.0.co;2-v
Google Scholar
[10]
Pizzi A; Stephanou A. On the chemistry, behavior, and cure acceleration of phenol-formaldehyde resins under very alkaline conditions. J Appl Polym Sci, 1993, 49, 2157-2170.
DOI: 10.1002/app.1993.070491212
Google Scholar
[11]
Tohmura S; Higuchi M. Acceleration of the cure of phenolic resin adhesives VI. Cure-accelerating action of propylene carbonate. Mokuzai Gakkaishi. 1995, 41: 1l09-1114.
Google Scholar
[12]
Zhao LW; Wang CP; Liu Y, et al. Preparation and application of fast curing phenol formaldehyde resin. Constr Build Mater, 2000, 27, 17-21.
Google Scholar
[13]
Chang RX; Lu RS. Study on reducing pressing time of PF particleboard by using curing agent . Chin Forest Prod Ind, 2002, 29, 16-18.
Google Scholar
[14]
Li JZ; Zhou Wr; Zhao JJ. The progress of fast-setting phenol-formaldehyde resin wood adhesive. China Adhes, 2003, 12, 61-63.
Google Scholar
[15]
Ou YN; Li JZ; Lei DD. Progress of fast-curing research of phenol-formaldehyde resin adhesives. Adhes China, 2006, 27, 38-40.
Google Scholar
[16]
China State Bureau of Technical Supervision. GB/T 17657-1999, Test methods of evaluating the properties of wood-based panels and surface decorated wood-based panels. Beijing: Standards Press of China, (1999).
Google Scholar