A Study on Residual Stresses in Machined Brittle Material

Pei Lum Tso; Tsung Yun Tsai

doi:10.4028/www.scientific.net/AMR.1136.509

Paper Titles

Experimental Research on Flexible Polishing by Compound Diamond Powder
p.484

Ultraprecision Machining of Si₃N₄ Ceramics with Shear-Thickening Polishing
p.490

Surface and Subsurface Integrity of Glass-Ceramics Induced by Ultra-Precision Grinding
p.497

Wet-Etching Evaluation Method of Subsurface Damage after Grinding of Glass
p.503

A Study on Residual Stresses in Machined Brittle Material
p.509

Study on the Inherent Correlations of the Material Properties for Silicon Nitride Ceramic Balls
p.515

High-Speed Capturing of Stress Distribution of Workpiece under Ultrasonically Assisted Cutting Condition
p.520

Surface Integrity of AlSiC Composites Ground by Monolayer Brazed Diamond Wheels
p.526

Coupled Thermal-Mechanical Analysis of CO₂ Laser Irradiation on Fused Silica
p.531

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1136A Study on Residual Stresses in Machined Brittle...

A Study on Residual Stresses in Machined Brittle Material

Abstract:

Residual stresses in fused silica induced by two machining methods, diamond blade saw cutting and GC grinding wheel grinding, are studied in this study. Photoelastic method would be applied as measuring tool analyzing the gradient of residual stresses caused by different machining condition. This sentence is strange with analyzing the chips of grinding and observation of surface defects, it is assumed that the stresses gradient differs probably cause by the different material removal mechanism.

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Periodical:

Advanced Materials Research (Volume 1136)

Pages:

509-514

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1136.509

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Online since:

January 2016

Authors:

Pei Lum Tso*, Tsung Yun Tsai

Keywords:

Chip Formation, Fused Silica, Residual Stress

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References

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