Study on Mechanical Properties of Single-Crystal Silicon Carbide by Nanoindentation

Article Preview

Abstract:

In order to clarify the mechanical properties of single-crystal silicon carbide (SiC), nanoindentation was performed on a 4H-SiC wafer. The change of hardness with the angle between the wafer orientation flat and the indenter edge, the maximum load and the loading rate were investigated. The hardness reached maximum at an indentation load of 12 mN in the range of 3-50 mN. Hardness decreased under two conditions: when the edge of the indenter tip is parallel to the [11-20] direction, and when a very low loading rate was used. Transmission electron microscopy was used to observe dislocations and cracks under the indents. It was demonstrated that the deformation process of SiC involved three steps with respect to the increase of the indentation load. These results provide information for improving ductile machining process of single crystal SiC.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

549-554

Citation:

Online since:

January 2016

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2016 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] J. B. Casady and R. W. Johnson, Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review, Solid. State. Electron., 39, 96, (1996) 1409–1422.

DOI: 10.1016/0038-1101(96)00045-7

Google Scholar

[2] S. Goel, X. Luo, P. Comley, R. L. Reuben, and A. Cox, Brittle–ductile transition during diamond turning of single crystal silicon carbide, Int. J. Mach. Tools Manuf., 65, (2013) 15-21.

DOI: 10.1016/j.ijmachtools.2012.09.001

Google Scholar

[3] Y. B. Gerbig, C. a. Michaels, a. M. Forster, and R. F. Cook, In situ observation of the indentation-induced phase transformation of silicon thin films, Phys. Rev. B, 85, 10, (2012) 104102.

DOI: 10.1103/physrevb.85.104102

Google Scholar

[4] C. -Y. Yen, S. -R. Jian, Y. -S. Lai, P. -F. Yang, Y. -Y. Liao, J. S. -C. Jang, T. -H. Lin, and J. -Y. Juang, Mechanical properties of the hexagonal HoMnO3 thin films by nanoindentation, J. Alloys Compd., 508, 2, (2010) 523-527.

DOI: 10.1016/j.jallcom.2010.08.109

Google Scholar

[5] J. Yan, X. Gai, and H. Harada, Subsurface Damage of Single Crystalline Silicon Carbide in Nanoindentation Tests, J. Nanosci. Nanotechnol., 10, 11, (2010) 7808-7811.

DOI: 10.1166/jnn.2010.2895

Google Scholar

[6] W. C. Oliver and G. M. Pharr, An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, J. Mater. Res., 7, 6, (1992) 1564-1583.

DOI: 10.1557/jmr.1992.1564

Google Scholar

[7] J. Yan, H. Takahashi, J. Tamaki, X. Gai, H. Harada, and J. Patten, Nanoindentation tests on diamond-machined silicon wafers, Appl. Phys. Lett., 86, 18, (2005) 181913.

DOI: 10.1063/1.1924895

Google Scholar

[8] S. Nakashima and H. Harima, Raman investigation of SiC polytypes, Phys. Stat. Sol. (a), 162, 39, (1997) 39-64.

DOI: 10.1002/1521-396x(199707)162:1<39::aid-pssa39>3.0.co;2-l

Google Scholar

[9] J. Jang, M. J. Lance, S. Wen, T. Y. Tsui, and G. M. Pharr, Indentation-induced phase transformations in silicon: influences of load, rate and indenter angle on the transformation behavior, Acta Mater., 53, 6, (2005) 1759–1770.

DOI: 10.1016/j.actamat.2004.12.025

Google Scholar

[10] T. Kiriyama, H. Harada, and J. Yan, Finite element modeling of high-pressure deformation and phase transformation of silicon beneath a sharp indenter, Semicond. Sci. Technol., 24, (2009) 025014.

DOI: 10.1088/0268-1242/24/2/025014

Google Scholar