Characteristics in Grinding of YVO4 with a Resin Bond Diamond Wheel

Mei Qin Zhang; Yi Qing Yu; Guo Qin Huang; Xi Peng Xu

doi:10.4028/www.scientific.net/AMR.1136.66

Paper Titles

Experiment and Surface Roughness Prediction Model for Ti-6Al-4V in Abrasive Belt Grinding
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Grinding Technology of Cylindrical Surface with Protrusion
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Experimental Study on Profile Machining of Titanium Alloys with Superabrasive Tools
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Optimizing the Grinding Process through Reduction of the Loading of Grinding Tool by Infiltration
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Forces during Grinding Operation and its Relation to the Dressing Cycle
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Experimental Study of Fabrication of Cast-Iron Bonded cBN Grinding Wheels by V-EPC (I) - The Influence Factors on the Qualities of Grinding Layer
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1136Characteristics in Grinding of YVO4 with a Resin...

Characteristics in Grinding of YVO₄ with a Resin Bond Diamond Wheel

Abstract:

An investigation was undertaken to explore the grinding characteristics in grinding of yttrium vanadata (YVO4) crystal by using a resin diamond wheel. The grinding forces and surface roughness were measured and the morphological features of ground workpiece surfaces were examined. The results indicate that the depth of cut is the leading factor in affecting grinding forces whereas the surface roughness is mainly governed by the grinding speed. The material removal mechanism was found to be dominated by brittle fracture mode at conventional grinding speeds, and gradually transfer to ductile flow mode under higher grinding speeds, which is greatly related to the maximum undeformed chip thickness.

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Periodical:

Advanced Materials Research (Volume 1136)

Pages:

66-70

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1136.66

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Online since:

January 2016

Authors:

Mei Qin Zhang, Yi Qing Yu, Guo Qin Huang*, Xi Peng Xu

Keywords:

Force, Grind, Specific Energy, Surface Roughness, Yttrium Vanadata Crystal (YVO4)

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* - Corresponding Author

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