Signal Integrity of Power and Ground Plane Related to Vias in High Speed Embed System Board Design

Wen Long Zhu; Jian Qing Chen; Le Ping Liao; Wen Xiang Chen

doi:10.4028/www.scientific.net/AMR.121-122.33

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 121-122Signal Integrity of Power and Ground Plane Related...

Signal Integrity of Power and Ground Plane Related to Vias in High Speed Embed System Board Design

Abstract:

The operation speed of modern embed system has been upgraded from several hundred MHz to GHz. The signal vias through power/ground plane can have strong coupling effect and result in signal integrity problem. Analytical model including calculation of resonant frequencies, fields for simple rectangular structures can be used to estimate the resonant frequency and ideal position to place signal vias. Based on FDTD algorithm, a numerical modeling of powerd/ground plane with lumped elements is presented. The coupling effect between signal vias in power/ground plane with lumped elments can be analyzed by this model. Finally, coupling effect between signal vias under different conditions are discussed and some methods to improve signal integrity are proposed.

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Periodical:

Advanced Materials Research (Volumes 121-122)

Pages:

33-37

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.121-122.33

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Online since:

June 2010

Authors:

Wen Long Zhu, Jian Qing Chen, Le Ping Liao, Wen Xiang Chen

Keywords:

Embed System Board Design, Ground Plane, Power Plane, Signal Integrity

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